Lec. | Date | Subject | Reading | Course Notes | Internet | Papers | HWs |
---|---|---|---|---|---|---|---|
1 | 08/24 | Introduction | Chapter 1 | Class1 | MEMSCAP-MUMPs | ||
2 | 8/29 | Lithography | Chapter 2 | Class2 | Sandia MEMS Videos, Videos | paper 1 | |
3 | 8/31 | Lithography | Chapter 2 | Class3 | MUMPs Process | ||
4 | 9/5 | Oxidation | Chapter 3 | Class4 | PolyMUMPs-references | paper 2 | HW #1,Solution |
5 | 9/7 | Oxidation | Chapter 3 | Class5 | MUMPs Design Standards | ||
6 | 9/12 | Oxidation, Pin-joints | Chapter 3 | Class6 | MEMS Industry Group | ||
7 | 9/14 | CAD Tools for MEMS | Chapter 3 | Class7 | MUMPs Microrobots | paper 3 paper 31 | HW #2,Solution |
8 | 9/19 | Comb Resonators | Chapter 3 | Class8 | MUMPs Nomenclature | ||
9 | 9/21 | Comb Resonator | Chapter 4 | Class9 | MUMPs History | paper 4 | |
10 | 9/26 | Diffusion | Chapter 4 | Class10 | Design Rules | ||
11 | 9/28 | Diffusion, Residual Stress | Chapter 4 | Class11 | Sandia SUMMit Process | paper 5 | HW #3,Solution |
12 | 10/3 | Diffusion | Chapter 4 | Class12 | BSAC | ||
13 | 10/5 | Diffusion, Hinges | Chapter 4 | Class13 | Sandia MEMS | HW #3 CAD file, | Old Exam, Solution |
14 | 10/10 | Heactuator | Chapter 4 | Class14 | Etching Data | paper 6 | HW #4, Solution |
15 | 10/12 | Scratch Drive, Vertical Comb | Class15 | Multiple Mode Resonator | CADproject | ||
16 | 10/17 | Review for Exam I | Chapter 6 | Class16 | Tangential Drive | HW#5, Solution | |
17 | 10/19 | Exam I | Chapter 6 | Class17 | Electromagnetic Actuator | ||
18 | 10/24 | Surface Micromachining Summary | Chapter 6 | Class18 | Vertical Actuator | paper 7 | HW #6, Solution |
19 | 10/26 | Project Introduction & Project Layouts | Chapter 6 | Class19 | MUMPs Microchannels | ||
20 | 10/31 | Thin Film Evaporation & MUMPs Design Rules | Chapter 6 | Class20 | MEMS Jobs | paper 8 | |
21 | 11/2 | LPCVD & Ion Implantation | Chapter 5 | Class21 | Clearing House | paper 9 | HW #7, Solution |
22 | 11/7 | Bulk-Micromachining | Chapter 11 | Class22 | MOSIS | ||
23 | 11/9 | Bulk-Micromachining | Chapter 11 | Class23 | MOSIS | ||
24 | 11/14 | LIGA | Class24 | MEMS Exchange | paper 10 | ||
25 | 11/16 | Review for Exam II | Class25 | Nanotechnology News | ImplantTable | ||
26 | 11/21 | Wafer Bonding & Packaging Process | Class26 | MEMS-Japan | |||
11/23 | Thanksgiving Holiday | ||||||
27 | 11/28 | Exam II | Class27 | LIGA Video | |||
28 | 11/30 | Project Presentations | Class28 | OldExam2 |
Last updated: May, 12 2022 by Liwei Lin