| Lec. | Date | Subject | Reading | Course Notes | Internet | Papers | HWs |
|---|---|---|---|---|---|---|---|
| 1 | 08/25 | Introduction | Chapter 1 | Class1 | MEMSCAP-MUMPs | ||
| 2 | 8/30 | Lithography | Chapter 2 | Class2 | Sandia MEMS Videos, Videos | paper 1 | |
| 3 | 9/1 | Lithography | Chapter 2 | Class3 | MUMPs Process | ||
| 4 | 9/6 | Oxidation | Chapter 3 | Class4 | PolyMUMPs-references | paper 2 | HW #1,Solution |
| 5 | 9/8 | Oxidation | Chapter 3 | Class5 | MUMPs FAQ | ||
| 6 | 9/13 | Oxidation, Pin-joints | Chapter 3 | Class6 | MEMS Industry Group | ||
| 7 | 9/15 | CAD Tools for MEMS | Chapter 3 | Class7 | MUMPs Microrobots | paper 3 paper 31 | HW #2,Solution |
| 8 | 9/20 | Comb Resonators | Chapter 3 | Class8 | MUMPs Schedule | ||
| 9 | 9/22 | Comb Resonator | Chapter 4 | Class9 | MUMPs Price | paper 4 | |
| 10 | 9/27 | Diffusion, Residual Stress | Chapter 4 | Class10 | Design Rules | ||
| 11 | 9/29 | Diffusion | Chapter 4 | Class11 | Sandia SUMMit Process | paper 5 | HW #3,Solution |
| 12 | 10/4 | Diffusion | Chapter 4 | Class12 | BSAC | ||
| 13 | 10/6 | Diffusion, Hinges | Chapter 4 | Class13 | Sandia MEMS | HW #3 CAD file, | Old Exam, Solution |
| 14 | 10/11 | Exam I | Chapter 4 | Class14 | Etching Data | paper 6 | HW #4, Solution |
| 15 | 10/13 | Heactuator | Class15 | Multiple Mode Resonator | CADproject | ||
| 16 | 10/18 | Scratch Drive, Vertical Comb | Chapter 6 | Class16 | Tangential Drive | HW#5, Solution | |
| 17 | 10/20 | Surface Micromachining Summary | Chapter 6 | Class17 | Electromagnetic Actuator | ||
| 18 | 10/25 | Project Introduction | Chapter 6 | Class18 | Vertical Actuator | paper 7 | HW #6, Solution |
| 19 | 10/27 | Thin Film Evaporation | Chapter 6 | Class19 | MUMPs Microchannels | ||
| 20 | 11/1 | Project Layouts & MUMPs Design Rules | Chapter 6 | Class20 | MEMS Jobs | paper 8 | |
| 21 | 11/3 | LPCVD & Ion Implantation | Chapter 5 | Class21 | Clearing House | paper 9 | HW #7, Solution |
| 22 | 11/8 | Bulk-Micromachining | Chapter 11 | Class22 | MOSIS | ||
| 23 | 11/10 | Bulk-Micromachining & LIGA | Chapter 11 | Class23 | MOSIS | ||
| 24 | 11/15 | Review for Quiz II | Class24 | MEMS Exchange | paper 10 | ||
| 25 | 11/17 | Exam II | Class25 | Nanotechnology News | ImplantTable | ||
| 26 | 11/22 | Wafer Bonding & Packaging Process | Class26 | MEMS-Japan | |||
| 11/24 | Thanksgiving Holiday | ||||||
| 27 | 11/29 | Project Presentations | Class27 | LIGA Video | |||
| 28 | 12/1 | Project Presentations | Class28 | OldExam2 |
Last updated: May, 12 2022 by Liwei Lin