Mechanical Science and Engineering
University of Illinois at Urbana-Champaign
Reversible dry adhesion-based transfer printing provides a highly straightforward pathway to heterogeneous material integration. The speaker presents his recent research outcomes accomplished in his laboratory which has been exploring responsive surfaces, microassembly, and nanomanufacturing technologies. The first part introduces an engineered reversible dry adhesive made of a shape memory polymer and highlights its consumer product-like prototype. The second part shows how his reversible dry adhesive advances transfer printing techniques to enable his microassembly called micro-LEGO and summarizes the applications of micro-LEGO with the examples not only of 3D heterogeneous micro-structures but also of devices such as a microtoroid resonator, a tip-tilt-piston micromirror, and a RF MEMS switch. Finally, the third part demonstrates his transfer printing techniques which are further exploited in order to pattern and integrate colloidal quantum dot films. The strategies presented in his talk benefit research activities in smart dry adhesives, 3D MEMS, and nano devices.
Seok Kim received his B.S. from Pohang University of Science and Technology, M.S. from University of California at Los Angeles, and Ph.D. from Carnegie Mellon University, all in mechanical engineering, and joined the faculty at the University of Illinois at Urbana-Champaign in 2011. His current research interests include: 1) biomimetic design of responsive surfaces for reversible dry adhesion, tunable wetting, and light manipulation, 2) transfer printing-based microassembly and nanomanufacturing, 3) 3D MEMS fabrication technologies. He was a recipient of the National Science Foundation CAREER Award in 2014, the ASME Chao and Trigger Young Manufacturing Engineer Award in 2015, and the Young Investigator Grant Award from the Korean–American Scientists and Engineers Association in 2015.
Hosted by: Professor Liwei Lin, 5135 Etcheverry Hall, 510-643-5495, email@example.com