Refereed Publications in Archival Journals, Monographs and Conference Proceedings
Carey, V.P. “On the Role of Wetting in Phase-Change Heat Transfer,” Thermal Science and Engineering, 10, pp. 3-9, 2002.
S.V. Garimella, Joshi, Y.K. , Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P.,Baelmans, M., Lohan, J., Sammakia, B. and Andros, F., “Thermal Challenges in NextGeneration Electronic Systems – Summary of Panel Presentations and Discussions,”IEEE Trans. Components and Packaging Technologies, 25, pp. 569-577, 2002.
Carey, V.P., “Thermodynamic Properties and Structure of the Liquid-Vapor Interface:A Neoclassical Redlich-Kwong Model,” J. Chem. Physics, 118, pp. 5053-5064, 2003.
Sun, C.-L. and Carey, V.P., “Effects of Gap Geometry and Gravity on Boiling Around aConstrained Bubble in 2-Propoanol/Water Mixtures,” paper HT2003-47123,Proceedings of the ASME Summer Heat Transfer Conference HT2003, Las Vegas, NV,2003.
Wemhoff, A. and Carey, V.P., “Molecular Dynamics Exploration of Properties in theLiquid-Vapor Interfacial Region,” paper HT2003-47158, Proceedings of the ASME Summer Heat Transfer Conference HT2003, Las Vegas, NV, 2003.
Shah, A.J., Carey, V.P., Bash, C.E and Patel, C.D., “Exergy Analysis of Data CenterThermal Management Systems, Proceedings of the 2003 IMECE, paper IMECE2003-42527, 2003.
Carey, V.P., “DSMC Modeling of Near-Interface Transport in Liquid-Vapor Phase-Change Processes with Multiple Microscale Effects,” Chapter 8 in Heat Transfer and Fluid Flow in Microscale and Nanoscale Structures, edited by M. Faghri and B. Sunden, pp. 303-347, WIT Press, Southampton, UK, 2004.
Carey, V.P. and Wemhoff, A.P., “Relationships Among Liquid-Vapor Interfacial RegionProperties – Predictions of a Thermodynamic Model, International Journal of Thermophysics, 25, pp. 753-785, 2004.
Wemhoff, A. and Carey, V.P., “Surface Tension Evaluation via ThermodynamicAnalysis of Statistical Data From Molecular Dynamics Simulations,” paper HTFED2004- 56690, Proceedings of the ASME International Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, 2004.
Shah, A.J., Carey, V.P., Bash, C.E and Patel, C.D., “Development and ExperimentalValidation of an Exergy-Base Computational Tool for Data Center ThermalManagement,” paper HTFED2004-56528, Proceedings of the ASME International Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, 2004.
Sun, C.-L. and Carey, V.P., “Marangoni Effects on the Boiling of 2-Propanol/WaterMixtures in a Confined Space,” International Journal of Heat and Mass Transfer, 47, 5417-5426, 2004.
Wemhoff, A.P. and Carey, V.P., “Exploration of Nanoscale Features of Thin Liquid Filmson Solid Surfaces Using Molecular Dynamics Simulations,” paper IMECE2004-59429,Proceedings of IMECE’04, 2004 ASME International Mechanical Engineering Congressand Exposition, Anaheim, CA, 2004.
Shah, A.J., Carey, V.P., Bash, C.E. and Patel, C.D, “An Exergy-Based Control Strategyfor Computer Room Air-Conditioning Units in Data Centers,” paper IMECE2004-61384,Proceedings of the 2004 IMECE, Anaheim, CA, 2004.
Wemhoff, A.P. and Carey, V.P., “Surface Tension Prediction from Density ProfileInformation by Polyatomic Molecular Dynamic Simulations, paper NANO2004-46090,Proceedings of the 2004 ASME Integrated Nanosystems Conference, Pasadena, CA, 2004.
Shah, A. J., Carey, V. P., Bash, C. E., Patel, C. D., “An Open-System, Exergy-BasedAnalysis of Data Center Thermal Management Components.” Presentation at InternationalMicroelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on ThermalManagement (THERM 2004), Palo Alto, CA, 2004.
Shah, A. J., Carey, V. P., Bash, C. E., Patel, C. D., “Impact of Chip Power DissipationProfiles on Thermodynamic Performance.” 21st Semiconductor Thermal Measurement,Modeling and Management (SEMITHERM) Symposium, San Jose, CA, 2005.
Shah, A. J., Carey, V. P., Bash, C. E., Patel, C. D. “Exergy-Based OptimizationStrategies for Multi-component Data Center Thermal Management: Part I, Analysis.” PacificRim/ASME International Electronic Packaging Technical Conference and Exhibition(IPACK2005-73137), San Francisco, CA, 2005.
Shah, A. J., Carey, V. P., Bash, C. E., Patel, C. D. “Exergy-Based OptimizationStrategies for Multi-component Data Center Thermal Management: Part II, Application andValidation,” Pacific Rim/ASME International Electronic Packaging Technical Conference andExhibition (IPACK2005-73138), San Francisco, CA, 2005.
Carey, V.P. and Wemhoff. A.P., “Thermodynamic Analysis of Near-Wall Effects on Phase Stability and Homogeneous Nucleation During Rapid Surface Heating,” International Journal of Heat and Mass Transfer 48, pp. 5431-5445, 2005.
Carey, V. P., Padilla, J. and Gan, Y. (2006) “Homogeneous Nucleation of Vapor at Preferred Sites During Rapid Transient Heating of Liquid in Micropassages,” Proceedings of the ASME 4th International Conference on Nanochannels, Microchannels and Minichannels paper ICNMM2006-96222, Limerick, Ireland, June, 2006 (also to appear in the J. Heat Transfer).
Wemhoff, A.P. and Carey, V.P., “Molecular Dynamics Exploration of Thin Liquid Films on Solid Surfaces. 1. Monatomic Fluid Films,” Microscale Thermophysical Engineering, 9, pp. 331-349, 2005.
Wemhoff, A.P. and Carey, V.P., “Molecular Dynamics Exploration of Thin Liquid Films on Solid Surfaces. 2. Polyatomic Nonpolar Fluid and Water Films,” Microscale Thermophysical Engineering, 9, pp. 351-363, 2005.
Gerner, F., Peterson, P. and Carey, V., “Chang-Lin Tien’s Contributions to Liquid Phase Change and Heat Pipes,” Annual Reviews of Heat Transfer, 14, pp. 297-311, 2005.
Wemhoff, A.P. and Carey, V.P., "Surface Tension Prediction Using Characteristics of the Density Profile Through the Interfacial Region," International Journal of Thermophysics ,27, pp. 413-436, 2006.
Shah, A., Carey, V., Bash, C., Patel, C., “Energy Efficiency Trends and Thermal Management Requirements for Computer Systems from the Chip to the Data Center” Proceedings of the 13th International Heat Transfer Conference, Sydney, paper ENR-13, Australia, 2006.
Carey, V.P. and Shah, A.J., “The Exergy Cost of Information Processing – AComparison of Computer-Based Technologies and Biological Systems,” Journal of Electronic Packaging, 128, pp. 346-352, 2006.
Shah, A.J., Carey, V.P., Bash, C.E., Patel, C.D. “An Exergy-Based Figure-of-Merit for Electronic Packages,” accepted for publication in the ASME Journal of Electronic Packaging,128, pp. 360-369, 2006.
Carey, V.P. and Wemhoff, A.P., “Disjoining Pressure Effects in Ultra-Thin Liquid Films in Micropassages – Comparison of Thermodynamic Theory with Predictions of Molecular Dynamics Simulations,” Journal of Heat Transfer, 128, pp. 1276-1284, 2006.
Sun, Chen-li. and Carey, V.P., “Effects of Gap Geometry and Gravity on Boiling Around a Constrained Bubble in 2-Propanol/water Mixtures,” Journal of Heat Transfer, 129, pp. 114-123, 2007.
Huang, C-K. and Carey, V.P., “The Effects of Dissolved Salts on Leidenfrost TransitionConditions,” International Journal of Heat and Mass Transfer, 50, pp. 269-282, 2007.
Carey, V. P., Padilla, J. and Gan, Y. “Homogeneous Nucleation of Vapor at Preferred Sites During Rapid Transient Heating of Liquid in Micropassages,” ASME Journal of Heat Transfer, 129, October, 2007 (accepted for publication, in press). (also published in the Proceedings of the ASME 4th International Conference on Nanochannels, Microchannels and Minichannels, paper ICNMM2006-96222, Limerick, Ireland, June, 2006.)
Shah, A., Carey, V.P., Bash, C. and Patel, C., "Exergy Analysis of Data Center Thermal Management Systems," Journal of Heat Transfer, 130, No. 2, 2008 (accepted for publication, in press).
Carey, V.P., “Molecular-Level Modeling Of Interfacial Phenomena - Use Of Molecular Dynamics Simulations in Tandem with Statistical Thermodynamics Models,” invited Keynote Paper (ICNMM2007-30157), Proc. ASME 5th International Conference on Nanochannels, Microchannels and Minichannels, Puebla, Mexico, June, 2007.
Guerra, R.G., Carey, V., Rubinsky, B. and Berger, M., “Characterization of the Focal Cooling Necessary to Suppress Spontaneous Epileptiform Activity,” paper HT2007-32034, Proceedings of the 2007 ASME-JSME Thermal Engineering and Summer Heat Transfer Conference, Vancouver, British Columbia, Canada, July, 2007.
Gan, Y. and Carey, V., “Stability of Thin Free Liquid Films and the Onset Conditions for Film Rupture – An MD Simulation Study,” paper HT2007-32003, Proceedings of the 2007 ASME-JSME Thermal Engineering and Summer Heat Transfer Conference, Vancouver, British Columbia, Canada, July, 2007.
Beaini, S. and Carey, V.P., “Heat Transfer for Annular Flow in Microchannel Bends: a Free Energy Minimization Model for Square Channels,” paper IMECE2007-43578, Proceedings of the 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, WA, November, 2007.
Articles in Books
Carey, V.P., "Boiling and Condensation," CRC Handbook of Thermal Engineering, section 3.4.1, pp. 3-91 to 3-106, CRC Press, Boca Raton,FL,, 2000.
Carey, V.P., "DSMC Modelling of Near-Interface Transport in Liquid-Vapour Phase-Change Processes with Multiple Microscale Effects," chapter in the forthcoming book Heat Transfer and Fluid Flow in Microscale and Nanoscale Structures, edited by M. Faghri and B. Sunden, WIT Press, Southampton, UK, 2003.
Books
Carey, V.P., Liquid-Vapor Phase-Change Phenomena, Hemisphere Publishing Corporation, New York, NY, February, 1992.
Carey, V.P., Statistical Thermodynamics and Microscale Thermophysics, Cambridge University Press, New York, NY, 1999.
Celata, G.P., Carey, V.P., Groll, M. and Tanasawa, I. (editors), Heat Transfer and Transport Phenomena in Microscale: Proceedings of the International Conference on Heat Transfer and Transport Phenomena in Microscale, Begell House, New York, NY, 2000.
Carey, V.P., Liquid-Vapor Phase-Change Phenomena, Hemisphere Publishing Corporation, New York, NY, February, 1992, Second Edition, 2007
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