Current Research
Microscale Loop Heat Pipe (MLHP)
Provides localized high-heat-flux thermal management for electronic substrates. Fabricated using MEMS technology on Silicon substrates for direct integration with electronic chips.
High Temperature Fluid Charging and Packaging
The MLHP working fluid should be de-gassed and filled in the right proportion. A high temperature compatible packaging setup is being developed to connect metal capillary tubing to the wafer scale micro loop heat pipe.
Numerical Modeling
Using thermodynamic and fluid-flow modeling, the heat carrying capacity of the micro loop heat pipe can be calculated as a function of various design parameters. This is used to optimize device design.
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