Research
Kyriakos Komvopoulos


Professor Komvopoulos is the Director of the Surface Mechanics and Tribology Laboratory (SMTL), which occupies 733 ft² on the fifth floor of the Department of Mechanical Engineering at the University of California at Berkeley (5119 Etcheverry Hall). The main research activity in SMTL is on mechanical characterization of thin films, plasma, ion-beam and laser-aided thin film deposition, surface engineering and reliability of MEMS devices, tribology and mechanics in magnetic recording, analytical and finite element contact mechanics studies, fatigue and fracture of coatings, high-temperature formulated lubricants for automotive applications, and nano-/micro-scale behavior of polymers and biomaterials. This research program is mainly funded through grants from NSF, DARPA, Sandia National Laboratories, NIST, CML, Chevron Chemical Co., and the UC Berkeley Research Board.


SMTL is equipped with RF sputtering facility (Perkin-Elmer Randex), ion beam film deposition system, high-vacuum system for polymer plasma treatment and MEMS monolayer deposition, multi-probe environmental chamber (MMR Tech-nologies, Inc.) for stiction and reliability testing of various MEMS devices, AFM and STM (Nanoscope II, Digital Instruments), surface force microscope (Triboscope, Hysitron, Inc.) for nano-mechanical/tribological studies, scratch tester with acoustic emission capability, pin-on-disk tribometer, ball-on-flat tribometer (Falex Inc.) with in situ electrical contact resistance capability, and a computational facility consisting of an IBM RS6000-540 system, an NEC 386/20 PC, a Dell-Pentium 586 station, two Pentium I workstations, six Intel-Pentium III stations, and two Dell-Pentium 4 Dimension 8200 stations.

The main thrust areas in SMTL are: (a) contact mechanics, (b) MEMS, (c) thin films, (d) biopolymers, and (e) lubrication. Project summaries accompanied by selected results of the various projects, currently in progress in MSTL, are given below.

 

List of Ongoing Research Projects

 

A. Contact Mechanics

1.Contact Stress Analysis of Elastic Layered Media with Fractal Surface Topographies

 

2. Finite Element Contact Analysis of Elastic-Plastic Layered Media

 

3. A Generalized Contact Mechanics Analysis of Elastic-Plastic Spherical

 

4. Molecular Dynamic Analysis of Indentation and Sliding Contact

 

B. MEMS

5. Adhesion Forces and Dynamic Friction at MEMS Interfaces

 

6. Fatigue of Polycrystalline MEMS Devices

 

7. Dynamic Analysis of MEMS Resonators

 

8. Stress Analysis and Crack Propagation Simulations in Polycrystalline Silicon

 

9. Design and Fabrication of Electrical Contacts for IC Probing at the Wafer Level

 

C. Thin Films

10. Effect of Plasma Conditions in Low-Pressure Radio-Frequency Discharges on Thickness and Surface Roughness of Thin Carbon Films (Single and Multilayer)

 

11. Femtosecond Laser Aperturless Near-Field Surface Nanomachining Assisted by Scanning Probe Microscopy

 

D. Biopolymers

12. Tribology of Total Joint Replacements

 

13. AFM and SFG Vibrational Spectroscopy Studies of Biopolymers

 

E. Lubrication

14. Tribological Behavior of Steel Surfaces Lubricated with Gear Oil Containing Sulfide, Phosphate,and Metal Deactivator Additions

                       


Summaries of Ongoing Research Projects

 

 

A. Contact Mechanics

 

1. Contact Stress Analysis of Elastic Layered Media With Fractal Surface Topographies

Knowledge of the contact stresses generated when two rough surfaces come into contact play a critical role in understanding most mechanisms of friction and wear. A two-dimensional contact model was developed for elastic layered media with rough surfaces characterized by fractal geometry. Contact pressure profiles and stresses are computed based on the distribution of real asperity microcontacts. Numerical results for the contact load and real contact area are presented as a function of fractal dimension, elastic properties, and maximum surface interference. Results for the surface tensile stresses that may cause surface cracking have been obtained in terms of the maximum surface interference and friction coefficient. The dependence of subsurface stress state on the modulus ratio, maximum surface interference, fractal dimension, and friction coefficient is also examined in light of the evolution of von Mises equivalent stress in the layered media. This work is currently extended to the thermomechanical analysis to include frictional heating.

 

 

2. Finite Element Contact Analysis of Elastic-Plastic Layered Media with Patterned Surfaces

A three-dimensional finite element analysis of a sphere (rigid or deformable) indenting and sliding over an elastic-plastic layered medium with a patterned surface consisting of equally spaced rectangular pads was conducted in order to investigate the effect of surface patterning on the contact pressure distribution and subsurface stress-strain field. Sliding simulations were performed for constant surface interference and lateral displacements approximately equal to two times the pad width. Three complete loading cycles were simulated in order to assess the effect of repeated sliding on the stresses in the first (hard) layer and plastic strain in the underlying (soft) layer. The close similarity of the plastic zones in each pad confirms that interaction of the stress fields of each pad was found to be negligible and deformation is only a function of the pad geometry and material properties of each layer. Thermomechanical simulations of normal and sliding contact of an elastic-plastic layered medium with a patterned surface and a deformable sphere with properties identical to those of the first layer are performed to elucidate the effect of frictional heating at the sliding surface on contact deformation. The objective is to obtain solutions for the temperature distribution along the surface and the maximum temperature variation and evolution of subsurface plasticity in terms of Peclet number. The likelihood of thermal cracking in the wake of microcontacts during sliding is another objective of this work.

 

 

3. A Generalized Contact Mechanics Analysis of Elastic-Plastic Spherical Indentation

The objective of this research is to elucidate the deformation behavior of an elastic-plastic half-space indented by a rigid sphere, during loading and unloading. Emphasis is given to the effect of material properties, in terms of reduced elastic modulus-to-yield strength ratio, on the deformation behavior. A finite element model of frictionless indentation is developed and verified by comparing the numerical results, in the elastic deformation regime, to the Hertz theory. The analysis yields dimensionless constitutive relations for the normal load, contact area, and mean contact pressure during loading for a wide range of material properties and for interference distances ranging from the inception of yielding to the initiation of fully plastic deformation. The boundaries between elastic, elastic-plastic, and fully plastic deformation regimes are determined in terms of interference distance, mean contact pressure, and reduced elastic modulus-to-yield strength ratio. Relations for the hardness and corresponding interference distance versus elastic-plastic material properties and truncated contact radius are introduced, and the shape of the plastic zone and maximum equivalent plastic strain are interpreted in the context of finite element simulation results. The unloading response of the spherical indenter is also analyzed to evaluate the validity of basic assumptions in traditional indentation approaches used to measure the hardness and reduced elastic modulus of materials. An alternative approach for determining the reduced elastic modulus, yield strength, and hardness of materials is proposed based on the obtained results.

 

 

4. Molecular Dynamic Analysis of Indentation and Sliding Contact

Dynamic response of an FCC substrate under contact loading is studied using molecular dynamic simulations. Two-body inter-atomic potentials (Lenard-Jones and Morse potentials) are used to characterize the interaction between atoms.  Indentation of the FCC substrate by a rigid tip shows that in case the tip and the substrate are of the same material the interfacial adhesion is relatively strong, while when the tip and substrate materials are different the adhesion is much weaker.  Sliding between a diamond tip and an FCC copper-like substrate is also simulated.  It has been found that for a prism tip the friction coefficient is sensitive to the tip substrate interference, while for pyramidal tip it is relatively insensitive. For prism-shaped tip, the friction coefficient decreases as the tip bottom size increases. Sliding with the tip-edge at the front produces lower friction coefficient than sliding with the tip-face at the front.  Stresses can be defined from the traction vectors passing a plane segment. Using this stress definition, the phenomena of surface tension in a single crystal solid was verified. The stress field in an elastically deformed FCC substrate in contact with a rigid diamond tip was obtained, and it was found that the distribution of the von Mises stress is similar to that predicted by continuum mechanics with some difference caused by surface tension effect.


 

 

 

B. MEMS

 

5. Adhesion Forces and Dynamic Friction at MEMS Interfaces

The objective of this research is to study adhesion and microtribological behavior relevant to micromachines.  Emphasis is given to the study of high friction leading to stiction during operation resulting from capillary, van der Waals, and electrostatic forces. Passive microstructures exhibiting a wide range of stiffness and surface roughness are used to gain further insight into the magnitude of the stiction force as a function of surface roughness and surface energy resulting from different texturing and chemical treatment processes.  The passive devices are an adaptation of the more classical microcantilevers, where the transition from stuck and free-standing configuration is used to determine the surface energy. 

 

Other test vehicles for this study are active microdevices designed and fabricated with friction and wear testing in mind.  High static friction (stiction) is investigated by testing friction couples relevant to micromachines.  The active microdevices are also used to study the effect of surface roughness, environmental conditions, mechanical properties, and loading conditions, commonly encountered in MEMS devices, on the electrical resistance formed between two contacting surfaces. The experimental work is accompanied by theoretical modeling, where the surface roughness is characterized by fractal geometry using AFM measurements of the microdevice interfacial microtopographies. 

 

The lubrication efficacy of different self-assembled monolayers (SAM), such as OTS and FDTS, and monolayers, such as DDMS and 1-octadecane, under various environments is the most recent activity in this project.  A vapor phase deposition chamber using inductively coupled RF plasma is used to deposit the previous layers.  Dynamic friction testing is used to determine the endurance of the lubricant layers in terms of contact load and environmental conditions (e.g., temperature and pressure).

 

 

6. Fatigue of Polycrystalline MEMS Devices

In view of recent rapid developments in micromachine devices, there is a pressing need to obtain information about the dynamic material behavior at scales relevant to MEMS. The significance of such information is of paramount importance to the development of reliable MEMS devices capable of performing sensing, actuation, and computing functions in a robust manner. To increase the reliability and longevity of micromachines, it is essential to accurately determine the material response under both static and dynamic loading conditions. The present understanding of fatigue at the MEMS scale and, more importantly, the effect of processing parameters, geometry, loading, and environmental conditions is sparse. This research is expected to bridge this gap by generating the necessary knowledge that will lead to increased productivity and significant broadening of the application range of MEMS devices.

 

This research program is seeking to develop novel microstructures for fatigue testing under conditions typical of most MEMS devices. The main goals of this research that have been accomplished are:

 

  • Develop a new microstructure design appropriate for performing multiaxial fatigue testing at the MEMS scale.
  • Determine new experimental procedures for fatigue testing under controlled environmental conditions resembling those in MEMS applications.
  • Develop fatigue lifetime curve for polysilicon.
  •  

    Future studies include:

     

  • Study the dependence of fatigue life on specimen size, etch type, operation temperature, anneal time, and relative humidity, and the effects of different processing conditions on the elastic modulus and residual stress in polysilicon using resonant microstructures processed on the same wafer as the fatigue specimens.
  • Examine the effect of wet etching on grain size and defect density on polysilicon surfaces.
  • Perform analytical and FEM modeling of the fatiguing specimens based on phenomenological observations obtained from the experimental studies.
  •  

     

    7. Dynamic analysis of MEMS resonators

    Dynamic characteristics of MEMS devices are of great importance, especially for inertia measurement applications. In this research, the dynamic behavior of specially designed fatigue resonators is analyzed.The finite element method (FEM) is employed to extract the natural frequency and simulate the dynamic response of the fatigue resonators, which requires excessive computational time to reach steady state. Therefore, a more efficient analytical method with reasonable accuracy suitable for dynamic behavior analysis of various MEMS devices was employed. Analytical results were found to be in good agreement with FEM results. With the aid of this analytical method, the nonlinear dynamic behavior of the fatigue resonators was analyzed and the effects of damping ratio, loading, and geometry on the dynamic behavior were interpreted.

     

     

    8. Stress analysis and crack propagation simulations in polycrystalline silicon

    Although FEM dynamic analysis can yield accurate results for both the resonant amplitude and the equivalent stress distribution in the fatigue devices, it requires a prohibitively long computational time to reach steady state. Based on the simple analytical method proposed in the dynamic behavior response analysis, a computationally efficient method (i.e., equivalent static analysis) was introduced to produce an equivalent stress distribution field for the resonant amplitude equivalent to that obtained from the FEM dynamic analysis. A comparison of the equivalent stress contours clearly shows that the result obtained from the equivalent static analysis is essentially identical to that of the FEM dynamic analysis.

     

    Polysilicon, the common structural material in MEMS, is often assumed to be homogenous and isotropic. However, as the characteristic size of MEMS devices approaches the diameter of the polysilicon grains, such simplification is no longer appropriate due to the inherent inhomogeneity and anisotropy of polysilicon at this scale. In this work, a Poisson VoronoiDiagram (PVD) is used to simulate the polycrystalline structure. FEM models with the polycrystalline structure (represented by PVD) incorporated in the critical region (beam-anchor region) were constructed and the difference in stress due to different material property was studied. Based on these FEM models, crack propagation within one grain is simulated for the {100} texture. Crack propagation simulations show that the crack growth path is independent of the orientation angle of surrounding grains and that the crack propagates almost straight within the grain. However, once the crack tip reaches the grain boundary, crack propagation along the grain boundary may occur (transgranular fracture) since the maximum effective stress intensity factor along the grain boundary, which probably exhibits lower fracture toughness, is comparable to that predicted for crack growth within the neighboring grain (intragranular fracture).

     

     

    9. Design and Fabrication of Electrical Contacts for IC Probing at the Wafer Level

    The semiconductor industry currently tests integrated circuits (IC) at the wafer level in order to avoid delays and wasting resources due to packaging of bad dies. This testing has traditionally been performed with tungsten cantilever probes on peripheral Al-Cu or Al-Cu-Si bond pads. The geometry of the cantilever probe is such that the probe tip scratches the bond pad when the die is driven towards the probes. This scrubbing action breaks the native oxide film that covers the bond pad and permits good electrical contact. As IC's have become ever more complex, the number of I/O and power and ground lines have also increased. The traditional peripheral layout of bond pads does not lend itself well to a very large number of pads as the larger number necessitates a larger dice footprint on the wafer. The semiconductor industry has for some time now used "flip-chip" packaging to address this problem in high pin count devices. However, the array arrangement of eutectic Sn-Pb solder bumps used in "flip-chip" packaging excludes the use of the tungsten cantilever probes due to the geometrical constraint when attempting to access the innermost bumps. Vertical probes are used instead, and these are designed to have vertical compliance and some wiping action. A few vertical designs have received commercial acceptance; but each technology has its limitations; and none can yet declare victory. In this study, the vertical contact problem is investigated in an attempt to better understand the effects of temperature, mechanical and electrical loading, tip shape, and contacting materials on contact resistance, damage to the bump/pad, and oxidation, deformation, and wear of the probe tip. In particular, the performance of precious metal coatings (such as Ir, Rh, Au, Pt, Pd, and C) deposited onto silicon wafers by ion beam assisted deposition and probes of Be-Cu base material are examined. The research comprises deposition of the coating material onto probe tips, microstructure characterization, and electric contact resistance and mechanical property evaluation to determine the optimum coating deposition conditions.

     

     

     

     

    C. Thin Films

     

    10. Effect of plasma conditions in low-pressure radio-frequency discharges on thickness and surface roughness of thin carbon films

    Characteristics of low-pressure rf discharges in pure Ar atmospheres and the effect of plasma conditions on the thickness and roughness of ultrathin a-C films deposited on Si(100) substrates by rf sputtering system are investigated experimentally. The observed characteristics of capacitive rf discharges at low working pressures (<10 mTorr) are interpreted in terms of energy balance and sheath capacitance considerations. The rf sputtering deposition system has to be tuned in order to efficiently deliver energy from the source to the discharge, and better control the discharge process for a-C film deposition. It was found that the quality of the a-C films depends strongly on the rf sputtering process conditions. The film thickness, measured directly from TEM images, depends linearly on the sputtering rate. The energetic particles bombarding on the film surface (rejected C atoms and Ar+ ions) significantly improves the film’s surface roughness (rms surface roughness < 0.2 nm) with increasing particle kinetic energy up to ~ 200 eV.

     

     

    11. Femtosecond laser aperturless near-field surface nanomachining assisted by scanning probe microscopy

    In this project conducted jointly with Professor C. Grigoropoulos, ultra-short pulsed-laser radiation is used for precision materials processing and surface nano-/micro-modification. Controllable surface nanomachining can be achieved by femtosecond laser pulses through local field enhancement in the near-field of a sharp probe tip. Nanomachining of thin gold films has been demonstrated by coupling 800-nm femtosecond laser radiation with a silicon tip in ambient air. Results illustrate the flexibility of this scheme to produce various nanopatterns, such as multiple line nanogrid structures, nanocraters, and nanocurves. The present process provides an intriguing means for massive nanofabrication due to the flexibility in the substrate material selection, high spatial resolution of ~10 nm (not possible with standard nanomachining techniques), and fast processing rates achievable through simultaneous irradiation of multiarray tips.

     

     

     

     

    D. Biopolymers

     

    12. Tribology of Total Joint Replacements

    In a total knee joint replacement, a metallic femoral component articulates against an ultra-high molecular weight polyethylene (UHMWPE) tibial component is commonly used. The life of this orthopedic component is limited by the generation of polyethylene particles causing implant loosening and chronic pain associated with osteolysis. Reduction of wear debris is critical to extending the life of joint replacements, and basic understanding of the fundamental wear mechanisms is essential to achieving this goal.

    The accumulation of plastic deformation coupled with texture development of the polyethylene crystal lamellae is considered to be the prime reason for the formation of wear debris by delamination wear. This is supported by recent work in our laboratory focused on the structural evolution of UHMWPE occurring due to the effects of contact stresses and different sliding speeds. Pin-on-disk Wear tests performed with polished CoCr alloy disk and UHMWPE flat pins lubricated with bovine serum at a range typical of physiological pressures and relative speeds. Typical coefficient of friction of plots for rough and smooth CoCr surfaces are in ranges of 0.12~0.14 and 0.06~0.08, respectively.

    Transmission electron microscopy has revealed that lamellae alignment parallel to the sliding direction may occur even at low contact pressures. This is an early warning of delamination wear, a damage process leading to excessive wear debris formation. Scanning Electron Microscope (SEM) pictures of wear tested UHMWPE pin surface show formation of fibrils and ripples (or folds), typical of early wear mechanisms.

    Ongoing research, funded by NSF, is focused on the plasma-assisted modification of the surface chemistry and microstructure of medical-grade UHMWPE and testing of the surface topography and friction and wear properties using an atomic force microscope and a reciprocating pin-on-disk apparatus under contact conditions resembling those at artificial knee replacements. Recent cytotoxicity results indicate that treatment with plasmas of Ar, C3F6, CH4, NH4, and hex-amethyldisiloxane (HMDSO) produce surface moieties that are nontoxic to the cells, as compared to negative and positive controls of Latex and silicone, respectively. Hemolysis studies demonstrated that the overall effect of these plasma treatments on the cells examined is marginal.

    This early research has led to a recent US patent (#6, 379, 741) The ultimate objective of this research is to determine the effects of different plasma chemistries and process conditions on the resulting surface microstructures and chemical state and, in turn, on the tribological properties and biocompatibility of medical-grade polyethylene. A nanoindentation and atomic force microscopy determine localized changes in surface mechanical properties due to plasma surface treatments. A customized plasma chamber, which can be used to study in-situ plasma characteristics evaluation, has been designed and is currently under construction.

     

    13. AFM and SFG Vibrational Spectroscopy Studies of Polymers

    This research program, performed jointly with Professor G. A. Somorjai from the UC Berkeley Chemistry Department, aims to provide new insight into the surface nanomechanical properties and molecular behavior of various polymeric materials subjected to different stress/strain conditions. The work includes the following two main activities:

     

    (a) Molecular surface structure and chemical composition of very thin polymer films

    The study of the surface structure and composition of very thin polymer films is the goal of this research. Copolymer (poly(methylmethacrylate), PMMA) and block copolymer (poly(methylmethacrylate)-polystyrene, PMMA-PS) are examined to obtain a basic molecular-level understanding of composition and molecular orientation at these polymer surfaces. Ultra-thin polymer films are prepared from dilute polymer solutions. The solutions are spun cast on different, smooth, solid substrates (glass, silicon, and metal surfaces) to produce polymer films of varied thickness. Film topography is examined by AFM, and film thickness is determined from ellipsometry. The effect of annealing on the surface molecular composition and structure is studied using SFG. Particular emphasis is placed on the effects of film thickness and molecular weight on the surface chemical composition.

     

    (b) Effects of polymer chain and reversible deformation on molecular surface structure of polyurethane copolymer

    The surface molecular structure and the deformation mechanisms of two polyurethane (PUR) short-segmented copolymers are studied by sum frequency generation (SFG) vibrational spectroscopy. These polyurethanes differ only in the length of their hard segment, where the molecular weight of the hard segment in one composition (710 g/mol) is twice as much as in the other (1450 g/mol). Surface deformation is induced by cyclically stretching the PUR films to a macroscopic elastic elongation. The surfaces are investigated by monitoring the SFG spectra, which gives information related to the backbone methylene orientation. Results for both PUR compositions indicate that the upward orientation of the methylene group that contribute to the SFG signal increases with elongation and decreases upon relaxation. The surface of PUR with shorter hard segments exhibits irreversible deformation at the molecular level resulting in a composition similar to that of the PUR with longer hard segments that is only elastically deformed after three stretching cycles. Based on the obtained results, two methods for producing similar surface compositions of PUR block copolymers can be proposed: (a) macroscopic elastic cyclic stretching and relaxation of the polymer or (b) increasing the molecular weight of the hard segment in the copolymer chain.

     

     

     

     

    E. Lubrication

     

    14. Tribological Behavior of Steel Surfaces Lubricated with Gear Oil Containing Sulfide, Phosphate, and Metal Deactivator Additions

    The objective of this research, funded by Chevron Oronite Co., is to evaluate the tribological behavior of a full-formulated lubricant using various additives including sulfide, phosphate, and metal deactivator (oxidation inhibitor) in a base oil at low (~32 oC) and elevated (~100 oC) temperature regimes. Additives, such as the ones used in this study, have been used extensively to improve wear-resistance and reduce friction under high loads in many lubricated components, such as automotive gears and bearings.

     

    A ball-on-disk tribometer is used to obtain the friction coefficient and electrical contact resistance (ECR) responses. The ECR is used as a method to detect the presence of an insulating anti-wear tribofilm by producing a contact voltage response (see figures for the steady-state friction responses for the various lubricants tested under boundary lubrication conditions and an example of a typical ECR response for the phosphate lubricant in base oil at elevated temperatures indicating the presence of a tribofilm.) Surface profilometry is performed to evaluate the tribofilm’s wear resistance in terms of the disk wear rate for the various lubricants and scanning electron microscopy (SEM) images of the disk wear surface are obtained to determine the dominant wear mechanisms under various lubrications at elevated temperatures. SEM images revealed the presence of adhesive and/or abrasive wear and evidence of tribofilm formation.

     

    Results from the various tests demonstrate a strong dependence of temperature and type of additives on the tribological behavior of the different oil blends. While the addition of additives reduced the coefficient of friction at elevated temperatures slightly, the effect on the wear resistance at both low and elevated temperatures was pronounced compared to the base oil. However, the wear resistance of the individual formulations decreased at elevated temperatures, suggesting possibly a weaker tribofilm strength and/or attachment to the metal surfaces at high temperatures.

     

    Work in progress involves friction/wear testing, ECR, profilometry, SEM, XPS, and nanoindentation methods to characterize the composition and nanomechanical properties of the produced anti-wear tribofilms.