----- Title: ----- Advances in Boundary Element Methods ----------- Organizers: ----------- Ernie Pan Department of Civil Engineering The University of Akron Akron, OH 44325-3905, United States E-mail: pan2@uakron.edu Tel.: 1 (330) 972-6739 Yijun Liu Department of Mechanical Engineering University of Cincinnati Cincinnati, OH 45221-0072, United States E-mail: Yijun.Liu@uc.edu Tel.: 1 (513) 556-4607 Martin Schanz Graz University of Technology Institute of Applied Mechanics Technikerstr. 4, A-8010 Graz, Austria E-mail: m.schanz@tugraz.at Tel.: 43 (316) 873-7600 Mitsunori (Mitch) Denda Department of Mechanical & Aerospace Engineering Rutgers, The State University of New Jersey New Brunswick, NJ 08901, United States E-mail: denda@jove.rutgers.edu Tel.: 1 (732) 445-4391 ------------------------- Minisymposium description: ------------------------- A minisymposium on Advances in Boundary Element Methods is being organized for the 9th US National Congress on Computational Mechanics (USNCCM9) to be held in San Francisco, CA, July 22-26, 2007. This symposium will bring together researchers from academia, government research laboratories, and industries around the world to discuss the recent progresses in the development of the boundary integral equation and boundary element methods (BIE/BEM). Researchers from all countries are cordially invited to participate in this minisymposium. Presentations dealing with all aspects of the BIE/BEM formulations and applications as well as various fundamental solution-based multiscale and BIE/BEM-involved hybrid approaches are welcome. Topics will include, but be not limited to: 1. Fast boundary element methods (e.g., fast multipole methods, parallel computing, and others); 2. Large-scale, multi-scale and multi-physics analyses using BIE/BEM and combined methods; 3. Efficient coupling of the BEM with other methods; 4. Modeling of novel materials (e.g., NEMS/MEMS, composites, functionally graded, and others); 5. Wave propagation problems; Fracture mechanics problems; 6. Multiscale Green?s functions and applications; 7. Other formulations (e.g., boundary meshless methods, method of fundamental solutions); 8. Software development and industrial applications.