PUBLICATIONS
Liwei Lin

Journals

  1. Ongi Englander, Dane Christensen, and Liwei Lin, "The Integration of Nanowires and Nanotubes with Micro Structures," Int. J. of Materials and Product Technology accepted.
  2. Chieh Chang, Kevin Limkarilassiri and Liwei Lin, "Continuous Near-Field Electrospinning for Large Area Deposition of Orderly Nanofiber Patterns," Applied Physics Letters, accepted.
  3. Firas Sammoura, Y.K. Fuh and Liwei Lin, "Micromachined 95GHz Waveguide-fed Plastic Horn Antenna," Journal of Micromechanics and Microengineering, Vol. 18, 055009, 2008. pdf
  4. Firas Sammoura, Y.K. Fuh and Liwei Lin, "Micromachined Plastic W-Band Bandpass Filters," Sensors and Actautors - A: Physical, Vol. 147, pp. 47-14, 2008. pdf
  5. Ki Band Lee, Liwei Lin and Young-Ho Cho, "A Closed-form Approach for Frequency Tunable Comb Resonators with Curved Finger Contour," Sensors and Actautors - A: Physical, Vol. 141, pp. 523-529, 2008. pdf
  6. Takeshi Kawano, Heather Chiamori, Marcel Suter, Qin Zhou, Brian Sosnowchik, and Liwei Lin, "An Electrothermal Carbon Nanotube Gas Sensor," Nanoletters, Vol. 7, pp. 3686-3690, 2007. pdf
  7. Sha Li, Kai Zhang, Jui-Ming Yang, Liwei Lin and Haw Yang, "Single Quantum Dots as Local Temperature Markers," Nanoletters, Vol. 7, pp. 3102-3105, 2007. pdf
  8. Sha Li, L. Meadow Anderson, Jui-Ming Yang, Liwei Lin and Haw Yang, "DNA Transformation via Local Heat Shock," Applied Physics Letters Vol. 91, 013902, 2007. pdf
  9. Ki-Bang Lee and Liwei Lin, "Surface-micromachined Vertical Scanning Micromirror," Journal of Micromechanics and Microengineering, Vol. 17, pp. 1394-1401, 2007. pdf
  10. Andrew Cao, Jongbaeg Kim and Liwei Lin, "Bi-directional Electrothermal Electromagnetic Actuators," Journal of Micromechanics and Microengineering, Vol. 17, pp. 975-982, 2007. pdf
  11. Ongi Englander, Dane Christensen, Jongbaeg Kim and Liwei Lin, "Post-Processing Techniques for Locally Self-Assembled Silicon Nanowires," Sensors and Actuators - A: Physical, Vol. 135, pp. 10-15, 2007. pdf
  12. Lei Luo, Brian D. Sosnowchik and Liwei Lin, "Room Temperature Fast Synthesis of Zinc Oxide Nanowires by Inductive Heating," Applied Physics Letters, Vol. 90, 093101, 2007. pdf
  13. Andrew Cao, Phyllis Yuen and Liwei Lin, "Microrelays with Bi-Directional Electrothermal Electromagnetic Actuators and Liquid Metal Wetted Contacts," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 16, pp. 700-708, 2007. pdf
  14. Sha Li and Liwei Lin, "A Single Cell Electrophysiological Analysis Device with Embeded Electrode,"Sensors and Actuators - A: Physical," Vol. 134, pp. 20-26, 2007. pdf
  15. Firas Sammoura, JeongJin Kang, Young-Moo Heo, TaeSung Jung and Liwei Lin, "Polymeric Microneedle Fabrication Using a Micro Injection Molding Technique," Microsystem Technologies Journal, Vol. 13, pp. 517-522, 2007. pdf
  16. Ki-Bang Lee, Albert P. Pisano and Liwei Lin, "Nonlinear Behaviors of Comb Drive Actuator under Electrically Induced Tensile and Compressive Stresses," Journal of Micromechanics and Microengineering, Vol. 17, pp. 557-566, 2007. pdf
  17. Brian D. Sosnowchik and Liwei Lin, "Rapid Synthesis of Carbon Nanotubes via Inductive Heating", Applied Physics Letters, Vol. 89, 193112, 2006. pdf
  18. Takeshi Kawano, Dane Christensen, Supin Chen, Chung Yeung Cho and Liwei Lin, "Formation and Characterization of Silicon/Carbon Nanotube/Silicon Heterojunctions by Local Synthesis and Assembly," Applied Physics Letters, Vol. 89, 163510, 2006. pdf
  19. Mu Chiao, Kien B. Lam and Liwei Lin, "Micromachined microbial and photosynthetic fuel cells,: Journal of Micromechanics and Microengineering, Vol. 16, pp. 2547-2553, December, 2006. pdf
  20. Kien B. Lam, Eric Johnson, and Liwei Lin, "A MEMS Photosynthetic Electrochemical Cell Powered By Sub-Cellular Plant Photosystems," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 15. pp. 1243-1250, 2006. pdf
  21. Kien B. Lam, Elizabeth F. Irwin, Kevin E. Healy and Liwei Lin, "Bioelectroanalytic Self-Assembled Thylakoids for Micro Power and Sensing Applications," Sensors and Actuators - B: Chemical, Vol. 117, pp. 480-487, October, 2006. pdf
  22. Yu-Chuan Su and Liwei Lin, "Geometry and Surface Assisted Micro Flow Discretization," Journal of Micromechanics and Microengineering, Vol. 16, No. 9, pp. 1884-1890, 2006. pdf
  23. JongBaeg Kim, Hyuck Choo, Liwei Lin and Richard S. Muller, "Microfabricated Torsional Actuators Using Self-Aligned Plastic Deformation of Silicon," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 15, No. 3, pp. 553-562, June, 2006. pdf
  24. Mu Chiao and Liwei Lin, "Device-Level Hermetic Packaging of Microresonators by RTP Aluminum-to-Nitride Bonding," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 15, No. 3, pp. 515-522, June 2006. pdf
  25. DaoHeng Sun, Chieh Chang, Sha Li and Liwei Lin, "Near-Field Electrospinning," Nanoletters, Vol. 6, No. 4, pp. 839-842, 2006. pdf
  26. JongBaeg Kim, Dane Christensen and Liwei Lin, "Micro Vertical Comb Actuators by Selective Stiction Process," Sensors and Actuators - A: Physical, Vol. 127, pp. 248-254, 2006. pdf
  27. Lei Luo, Yanfeng Zhang, Samuel S. Mao and Liwei Lin, "Fabrication and Characterization of ZnO Nanowires Based UV Photodiodes," Sensors and Actuators - A: Physical, Vol. 127, pp. 201-206, 2006. pdf
  28. Firas Sammoura, Yu-Chuan Su, Ying Cai, Chen-Yu Chi, Bala Elamaran, Liwei Lin and Jung-Chih Chiao, "Plastic 95-GHz Rectangular Waveguides By Micro Molding Technologies," Sensors and Actuators - A: Physical, Vol. 127, pp. 270-275, 2006. pdf
  29. Kwok-Siong Teh, Yu-Ting Cheng and Liwei Lin, "MEMS Fabrication Based on Nickel-Nanocomposite: Film Deposition and Characterization," Journal of Micromechanics and Microengineering, Vol. 15, pp. 2205-2215, 2005. pdf
  30. Jongbaeg Kim, Dane Christensen and Liwei Lin, "Monolithic 2-D Scanning Mirror Using Self-Aligned Angular Vertical Comb Drives," IEEE Photonics Technology Letters, Vol. 17, No. 11, pp. 2307-2309, 2005. pdf
  31. Kwok-Siong Teh and Liwei Lin, "MEMS Sensor Material based on Polypyrrole-Carbon Nanotube Nanocomposite : Film Deposition and Characterization," Journal of Micromechanics and Microengineering, Vol. 15, pp. 1777-1785, 2005. pdf
  32. Brian D. Sosnowchik, Robert G. Azevedo, Andrew Cao, Liwei Lin and A.P. Pisano, " Silicon to Steel Bonding Using Rapid Thermal Annealing," IEEE Trans. on Advanced Packaging, Vol. 28, pp. 626-634, 2005. pdf
  33. Yu-Chuan Su and Liwei Lin, "Localized Bonding Processes for Assembly and Packaging of Polymeric MEMS," IEEE Trans. on Advanced Packaging, Vol. 28, pp. 635-642, 2005. pdf
  34. Jongbaeg Kim and Liwei Lin, "Electrostatic Scanning Micromirrors Using Localized Plastic Deformation of Silicon," Journal of Micromechanics and Microengineering, Vol. 15, pp. 1777-1785, 2005. pdf
  35. Ki-Bang Lee and Liwei Lin, "Vertically Supported Two-Directional Comb Drive," Journal of Micromechanics and Microengineering, Vol. 15, No. 8, pp. 1439-1445, 2005. pdf
  36. Ongi Englander, Dane Christensen, JongBaeg Kim, Liwei Lin and Stephen Morris, " Electric-Field Assisted Growth and Self-Assembly of Intrinsic Silicon Nanowires," Nanoletters, Vol. 5, No. 4, pp. 705-708, April 2005. pdf
  37. Li-Wei Pan, X.-J. Shen and Liwei Lin, "Microplastic Lens Array Fabricated by a Hot Intrusion Process," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 13, pp. 1063-1071, Dec. 2004. pdf
  38. Mu Chiao and Liwei Lin, "Post-packaging frequency tuning of microresonators by pulsed laser deposition," Journal of Micromechanics and Microengineering, Vol. 14, No. 12, pp. 1742-1748, 2004. pdf
  39. JongBaeg Kim and Liwei Lin, "A Micro Pitch and Roll Motion Sensor," Sensors and Actuators - A: Physical, Vol. A114, pp. 250-259, September 2004. pdf
  40. Steve Ryder, Ki-Bang Lee, X. Meng, and Liwei Lin, "AFM Characterization of Out-of-Plane High Frequency Microresonators," Sensors and Actuators- A: Physical, Vol. A114, pp. 135-140, September 2004. pdf
  41. Firas Sammoura, Ki-Bang Lee, and Liwei Lin, "Water-activated Disposable and Long Shelf Life Microbatteries," Sensors and Actuators - A: Physical, Vol. A111, pp. 79-86, 2004. pdf
  42. Yu-Chuan Su and Liwei Lin, "A Water-Powered Micro Drug Delivery System," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 13, pp. 75-82, 2004. pdf
  43. Ki-Bang Lee and Liwei Lin, "Surface Micromachined Glass and Polysilicon Microchannels Using MUMPs for BioMEMS Applications," Sensors and Actuators - A: Physical, Vol. A111, pp. 44-50, 2004. pdf
  44. Yu-Chuan Su, Jatan Shah and Liwei Lin, "Implementation and Analysis of Polymeric Microstructure Replication by Micro Injection Molding," Journal of Micromechanics and Microengineering, Vol. 14, No. 3, pp. 415-422, 2004. pdf
  45. Li-Wei Pan, Phyllis Yuen, Liwei Lin and Ernest J. Garcia, "Flip Chip Electrical Interconnection by Selective Electroplating and Bonding," Microsystem Technologies Journal, Vol. 10, No. 1, pp. 7-10, 2003. pdf
  46. Ki-Bang Lee and Liwei Lin, "Electrolyte-based On-demand and Disposable Microbattry," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 12, pp. 840-847, 2003. pdf
  47. Ongi Englander, Dane Christensen, and Liwei Lin, "Local Synthesis of Silicon Nanowires and Carbon Nanotubes on Microbridges," Applied Physics Letters, Vol. 82, No. 26, pp. 4797-4799, June 2003. pdf
  48. Daphne Joachim and Liwei Lin, "Characterization of Selective Polysilicon Deposition for MEMS Resonator Tuning," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 12, pp. 193-200, 2003. pdf
  49. Liwei Lin, "Thermal Challenges in MEMS Applications: Phase Change Phenomena and Thermal Bonding Processes," Microelectronics Journal, Vol. 34, pp. 179-185, 2003. pdf
  50. Jr-Hung Tsai and Liwei Lin, "A Thermal-Bubble-Actuated Micronozzle-Diffuser Pump," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 11, pp. 665-671, 2002. pdf
  51. Yu-Chuan Su, Liwei Lin and Albert P. Pisano, "A Water-Powered Osmotic Microactuator," IEEE/ASME Journal of Microelectromechanical Systems , Vol. 11, pp. 736-742, 2002. pdf
  52. Yu-Ting Cheng, W.T. Hsu, K. Najafi, C.T. Nguyen and Liwei Lin, "Vacuum Packaging Technology Using Localized Aluminum/Silicon-to Glass Bonding," IEEE/ASME Journal of Microelectromechanical Systems , Vol. 11, pp. 556-565, 2002. pdf
  53. Li-Wei Pan, Phyllis Yuen and Liwei Lin, "3D Electroplated Microstructures Fabricated by a Novel Height Control Method," Microsystem Technologies Journal, Vol. 8, pp. 391-394, 2002. pdf
  54. Jr-Hung Tsai and Liwei Lin, "Active Microfluidic Mixer and Gas Bubble Filter Driven by Thermal Bubble Micropump," Sensors and Actuators - A: Physical, Vol. A 97-98, pp. 665-671, 2002. pdf
  55. Cheng Luo and Liwei Lin, "The Application of Nanosecond-Pulsed Laser Welding Technology in MEMS Packaging with a Shadow Mask," Sensors and Actuators - A: Physical, Vol. A 97-98, pp. 398-404, 2002. pdf
  56. X.-J. Shen, Li-Wei Pan and Liwei Lin, "Microplastic Embossing Process: Experimental and Theoretical Characterizations," Sensors and Actuators - A: Physical, Vol. A 97-98, pp. 428-433, 2002. pdf
  57. Mu Chiao and Liwei Lin, "Accelerated Hermeticity Testing of a Glass-Silicon Package Formed by RTP Aluminum-to-Silicon Nitride Bonding," Sensors and Actuators - A: Physical, Vol. A 97-98, pp. 405-409, 2002. pdf
  58. Jr-Hung Tsai and Liwei Lin, "Transient Thermal Bubble Formation on Polysilicon Micro-Resisters," ASME Journal of Heat Transfer, Vol. 124, No. 2, pp. 375-382, 2002. pdf
  59. Yu-Ting Cheng, Liwei Lin and K. Najafi, "A Hermetic Glass-Silicon Package Formed Using Localized Aluminum/Silicon-Glass Bonding," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 10, No. 3, pp. 392-399, 2001. pdf
  60. Jr-Hung Tsai and Liwei Lin, "Micro-to-Macro Fluidic Interconnectors with an Integrated Polymer Sealant," Journal of Micromechanics and Microengineering, Vol.11, No. 5, pp. 577-581, 2001. pdf
  61. Mu Chiao and Liwei Lin, "Hermetic Wafer Bonding Based on Rapid Thermal Processing," Sensors and Actuators - A: Physical, Vol. 91A, pp. 404-408, 2001. pdf
  62. Todd Remtema and Liwei Lin, "Active Frequency Tuning for Microresonators by Localized Thermal Stressing Effects," Sensors and Actuators - A: Physical, Vol. 91A, pp. 326-332, 2001. pdf
  63. Liwei Lin, "Curriculum Development in Microelectromechanical Systems in Mechanical Engineering," IEEE Transactions on Education, Vol. 44, pp. 61-66, 2001. pdf
  64. Li-Wei Pan and Liwei Lin, "Batch Transfer of LIGA Microstructures by Selective Electroplating and Bonding," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 10, pp.25-32, 2001. pdf
  65. Li-Wei Pan, Liwei Lin and Jun Ni, "A Flip-Chip LIGA Assembly Technique via Electroplating," Microsystem Technologies Journal, Vol. 7, no. 1, pp. 40-43, 2001. pdf
  66. Liwei Lin (position paper), "MEMS Packaging at the Wafer Level," Journal of Materials Processing and Manufacturing Science, Vol. 8, No. 4, pp.347~349, 2000.
  67. Liwei Lin, "MEMS Post-Packaging by Localized Heating and Bonding," IEEE Trans. on Advanced Packaging, Vol. 23, pp. 608-616, Nov. 2000. pdf
  68. Liwei Lin, T.K. Shia and C.-J. Chiu, "Silicon-Processed Plastic Micropyramids for Brightness Enhancement Applications," Journal of Micromechanics and Microengineering, Vol. 10, No. 3, pp. 395-400, 2000. pdf, (Featured Article of JMM), ABC Science Online
  69. Mu Chiao and Liwei Lin, "Self-Buckling of Micromachined Beams Under Resistive Heating," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 9, pp.146-151, March 2000. pdf
  70. Yu-Ting Cheng, Liwei Lin and Khalil Najafi, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 9, pp. 3-8, March 2000. pdf
  71. Liwei Lin, Huey-Chi Chu and Yen-Wen Lu, "A Simulation Program for the Sensitivity and Linearity of Piezoresistive Pressure Sensors," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 8, pp. 514-522, December 1999. pdf
  72. Kwok Siong Teh and Liwei Lin, "Time-dependent Buckling Phenomena of Polysilicon Micro Beams," Microelectronics Journal , Vol. 30, No. 11, pp. 1169-1172, November 1999. pdf
  73. Liwei Lin and Albert P. Pisano, "Silicon Processed Microneedles," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 8, pp. 78-84, March 1999. pdf
  74. Liwei Lin, Yu-Ting Cheng and K. Najafi, "Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method," Japanese Journal of Applied Physics, Part II, Vol. 37, pp. L1412-1414, Nov. 1998. pdf
  75. Liwei Lin, R.T. Howe and A.P. Pisano, "Microelectromechanical Filters for Signal Processing," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 7, pp. 286-294, Sep. 1998. pdf
  76. Liwei Lin, A.P. Pisano and V.P. Carey, "Thermal Bubble Formation on Polysilicon Micro Resistors," ASME Journal of Heat Transfer, Vol. 120, pp.735-742, Sep. 1998. (Best Paper Award) pdf
  77. Liwei Lin and Weijie Yun, "Design, Optimization and Fabrication of Surface Micromachined Pressure Sensors," Mechatronics, Vol.8, pp. 505-519, Aug. 1998. pdf
  78. Liwei Lin and S.H. Lin, "Vertically Driven Microactuators by Electrothermal Buckling Effects," Sensors and Actuators - A: Physical, Vol. A71, pp.35-39, Nov. 1998. pdf
  79. Liwei Lin (Review Paper), "Microscale Thermal Bubble Formation: Thermophysical Phenomena and Applications," Microscale Thermophysical Engineering, Vol. 2, No. 2, April-June, pp.71-85, 1998. pdf
  80. Liwei Lin, Y.T. Cheng and C.-J. Chiu, "Comparative Study of Hot Embossed Microstructures Fabricated by Laboratory and Commercial Environments," Microsystem Technologies Journal, Vol. 4, No. 3, pp. 113-116, 1998. pdf
  81. Liwei Lin and M. Chiao, "Electrothermal and Elastic Characterization of Suspended Microbeams," Microelectronics Journal, Vol. 29, pp. 269-276, April-May 1998. pdf
  82. Liwei Lin, A.P. Pisano and R.T. Howe, "A Micro Strain Gauge with Mechanical Amplifier," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 6, pp. 313-321, Dec. 1997. pdf
  83. Liwei Lin and M. Chiao, "Electrothermal Responses of Lineshape Microstructures," Sensors and Actuators - A: Physical, Vol. A55, pp. 35-41, 1996. pdf
  84. Liwei Lin and A.P. Pisano, "Thermal Bubble Powered Microactuators," Microsystem Technologies Journal, Vol. 1, No. 1, pp.51-58, 1994. pdf
  85. Liwei Lin, K.S. Udell and A.P. Pisano, "Phase Change Phenomena on a Heated Polysilicon Micro Heater in Confined and Unconfined Micro Channels," Thermal Science and Engineering, Vol. 2, No. 1, pp. 52-59, 1994. pdf

Refereed Conference Proceedings

  1. Lei Luo, Brian Sosnowchik, and Liwei Lin, "UV-Enhanced Oxygen Sensing of Zinc Oxide Nanowires," Proceedings of 21th IEEE Micro Electro Mechanical Systems Conference , pp. 216-219, Tucson, AZ, Jan. 2008.
  2. Brian Sosnowchik, Yong-Yoon Ha, Lei Luo and Liwei Lin, "Rapid, Localized Synthesis of Titanium-based Nanoswords on MEMS," Proceedings of 20th IEEE Micro Electro Mechanical Systems Conference , pp. 693-396, Tucson, AZ, Jan. 2008.
  3. Yingqi Jiang, M.Q.H. Zhang, T. Kawano, C.Y. Cho and Liwei Lin, "Activation of CNT Nano-to-Micro Contact via Electrical Breakdown," Proceedings of 20th IEEE Micro Electro Mechanical Systems Conference , pp. 725-728, Tucson, AZ, Jan. 2008.
  4. Lei Luo and Liwei Lin, "Self-Assembled ZnO Nanowires via Local Vapor Transport Synthesis as UV Sensor," The 14th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 403-406, Lyon, France, June 10-14, 2007.
  5. Jiyoung Chang, Jongbaeg, Byung-Kwon Min and Liwei Lin, "THermally Driven Bimorph Nano Actuators Fabricated Using Focused Ion Beam Chemical Vapor Deposition," The 14th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 541-544, Lyon, France, June 10-14, 2007.
  6. Firas Sammoura and Liwei Lin, "A Plastic W-Band MEMS Phase Shifter," The 14th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 647-650, Lyon, France, June 10-14, 2007.
  7. T. Kawano, M. Suter, C.Y. Cho, H. Chiamori and L. Lin, "Single Carbon Nanotube Pirani Gauge by Local Synthesis," The 14th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 1015-1018, Lyon, France, June 10-14, 2007.
  8. Sha Li, Kai Zhang, Jui-Ming Yang, Liwei Lin, and Haw Yang, "MEMS Temperature Characterization by CdSe Quantum Dots," The 14th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 1369-1372, Lyon, France, June 10-14, 2007.
  9. Brian D. Sosnowchik and Liwei Lin, "Local Synthesis of Carbon Nanotubes by Bulk and Localized Inductive Heating," Proceedings of 20th IEEE Micro Electro Mechanical Systems Conference , pp. 835-838, Kobe, Japan, Jan. 2007.
  10. Takeshi Kawano, Chung Young Cho and Liwei Lin, "In-Situ Controled Growth of Carbon Nanotubes by Local Synthesis," Proceedings of 20th IEEE Micro Electro Mechanical Systems Conference , pp. 831-834, Kobe, Japan, Jan. 2007.
  11. Sha Li, L. Meadow Anderson, Liwei Lin and Haw Yang, "DNA Transformation by Local Heat Shock," Proceedings of 20th IEEE Micro Electro Mechanical Systems Conference , pp. 533-536, Kobe, Japan, Jan. 2007.
  12. SangHoon Lee, Kevin Limkrailassiri, Yuan Gao, Chieh Chang and Liwei Lin, "Chip-to-Chip Fluidic Connnectors via Near-Field Electrospinning," Proceedings of 20th IEEE Micro Electro Mechanical Systems Conference , pp. 61-64, Kobe, Japan, Jan. 2007.
  13. Brian D. Sosnowchik and Liwei Lin, "Chip-Scale Localized Synthesis of Carbon Nanotubes on Copper Microstructures via Inductive Heating," Second IEEE NEMS Conference, Thailand, Jan. 2007.
  14. Takeshi Kawano, Chung Yeung Cho and Liwei Lin, "Carbon Nanotube-based Nanoprobe Electrode" Second IEEE NEMS Conference, Thailand, Jan. 2007.
  15. Firas Sammoura and Liwei Lin, "A W-Band Horn Antenna Using Self-Aligned 3D Plastic Embossing Process," 2006 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Chicago, Nov. 2006.
  16. Jiyoung Chang, Jongbaeg Kim, Byung-Kwon Min, Sang Jo Lee, and Liwei Lin, "In-situ Frequency Tuning of Electrostatically Actuated Vibrating Nano Structures Using Focused Ion Beam," 2006 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Chicago, Nov. 2006.
  17. Brian D. Sosnowchik, Liwei Lin and A.P. Pisnao, "Rapid Silicon-to-Steel Bonding Using Inductive Heating," 2006 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Chicago, Nov. 2006.
  18. Firas Sammoura and Liwei Lin, "A Plastic W-Band MEMS Tunable Filter," IEEE International Microwave Symposium , IMS, pp. 136-139, San Francisco, June 2006.
  19. G.J. O'Brien, D.J. Monk and L. Lin, "MEMS Cantilever Beam Electrostatic Pull-in Model," Technical Digest of Solid-State Sensors and Actuators Workshop,
  20. Jiyoung Chang, Jongbaeg Kim, Byung-Kwon Min, Sang-Jo Lee and Liwei Lin, "Electrostatically Actuated Nano Tweezers Fabricated on Micro-Processed Electrodes," First IEEE NEMS Conference, China, Jan. 2006.
  21. Yun Huin Lin, Lei Luo and Liwei Lin, "A Biosensor for Simazine Herbicide Detection Using Sub-Cellular Plant Photosystems," First IEEE NEMS Conference, China, Jan. 2006.
  22. O. Englander, D. Christensen, J.B. Kim and Liwei Lin, "Post-Processing Techniques for the Integration of Silicon Nanowires and MEMS," Proceedings of 19th IEEE Micro Electro Mechanical Systems Conference , pp. 930-933, Istanbul, Turkey, Jan. 2006.
  23. S. Li and Liwei Lin, "Single Cell Electrophysiological Analysis via Sub-Micrometer Openings," 2005 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Orlando, FL, Nov. 2005.
  24. J. Kim, D. Christensen and Liwei Lin, "2-D Scanning Mirror Using Plastically Deformed Angular Vertical Comb Drive Actuator," The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 697-700, Seoul, Korea, June 5-9, 2005.
  25. F. Sammoura, Y. Cai, C.-Y. Chi, T. Hirano, Liwei Lin and J.-C. Chiao, "A Micromachined W-Band Iris Filter," The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 1067-1070, Seoul, Korea, June 5-9, 2005.
  26. K.B. Lam, E.F. Irwin, K.E. Healy and Liwei Lin, "Biological Self-Assembled Monolayers for Photosynthetic Solar Cell and Sensing Applications," The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 1772-1775, Seoul, Korea, June 5-9, 2005.
  27. L. Luo, Y. Zhang, S.S. Mao and Liwei Lin, "ZnO Nanowires Based UV Photodiodes," Proceedings of 18th IEEE Micro Electro Mechanical Systems Conference , pp. 427-430, Miami, Florida, Jan.30-Feb.3 2005.
  28. J. Kim, D. Christensen and Liwei Lin, "Selective Stiction Based Vertical Comb Actuators," Proceedings of 18th IEEE Micro Electro Mechanical Systems Conference , pp. 403-406, Miami, Florida, Jan.30-Feb.3 2005.
  29. A. Cao, P. Yuen and Liwei Lin, "Bi-Directional Micro Relays with Liquid-Metal Wetted Contacts," Proceedings of 18th IEEE Micro Electro Mechanical Systems Conference , pp. 371-374, Miami, Florida, Jan.30-Feb.3 2005.
  30. F. Sammoura, Y.-C. Su, Y. Cai, C.-Y. Chi, B. Elamaran, Liwei Lin and J.-C. Chiao, "Microfabricated Plastic 95-GHz Rectangular Waveguide," Proceedings of 18th IEEE Micro Electro Mechanical Systems Conference , pp. 167-170, Miami, Florida, Jan.30-Feb.3 2005.
  31. J.B. Kim and Liwei Lin, "A MEMS Tunable Capacitor Based on Plastically Deformed Vertical Comb Sets," 2004 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, Anaheim, CA, Nov. 2004.
  32. K.B. Lee, A.P. Pisano and Liwei Lin, "A Frequency-Tunable Comb Resonator Using Spring Tension and Compression Effects," 2004 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, Anaheim, CA, Nov. 2004.
  33. O. Englander, D. Christensen, J.B. Kim and Liwei Lin, "Direct Synthesis and Self-Assembly of Silicon Nanowires," 2004 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, Anaheim, CA, Nov. 2004.
  34. F. Sammoura, K.B. Lee and Liwei Lin, "Surface Tension Propelled Microboats," 2004 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, Anaheim, CA, Nov. 2004.
  35. A. Cao, B. Sosnowchik, Liwei Lin and A.P. Pisano, "Rapid Low Temperature Bonding of Silicon to Steel for MEMS Sensors," 2004 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, Anaheim, CA, Nov. 2004.
  36. K.B. Lee and Liwei Lin, "A Vertically-Supported Two-Axial Torsional Micromirror," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 41-44, Maastricht, Netherlands, Jan. 2004.
  37. K.B. Lam, E. Johnson and Liwei Lin, "A Bio-Solar Cell Powered by Sub-Cellular Plant Photosystems," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 220-223, Maastricht, Netherlands, Jan. 2004.
  38. K.B. Lee, Liwei Lin and Y.H. Cho, "A Frequency-Tunable Microactuator with a Varied Comb-width Profile," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 257-260, Maastricht, Netherlands, Jan. 2004.
  39. S. Li, W. Liu and Liwei Lin, "On-Chip Cryopreservation of Cells," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 287-390, Maastricht, Netherlands, Jan. 2004.
  40. K.S. Teh and Liwei Lin, "A Polypyrrole-Carbon-Nanotube (PPY-MWNT) Nanocomposite Glucose Sensor," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 395-398, Maastricht, Netherlands, Jan. 2004.
  41. A. Cao, J.B. Kim, T. Tsao and Liwei Lin, "A Bi-Directional Electrothermal Electromagnetic Actuator," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 450-453, Maastricht, Netherlands, Jan. 2004.
  42. J.B. Kim and Liwei Lin, "Batch-Fabricated Scanning Micromirrors Using Localized Plastic Deforemation of Silicon," Proceedings of 17th IEEE Micro Electro Mechanical Systems Conference, pp. 494-497, Maastricht, Netherlands, Jan. 2004.
  43. D. Christensen, O. Englander, J. Kim, and L. Lin, "Room Temperature Local Synthesis of Carbon Nanotubes," IEEE-Nano 2003, Technical Digest, pp.581-584, San Francisco, August 2003.
  44. M. Chau, O. Englander and L. Lin, "Nanostructure-based Nanoactuator," IEEE Nano 2003, Technical Digest, pp. 879-880, San Francisco, CA, August, 2003.
  45. K. S. Teh and L. Lin, "A Micro-Gap Sensor Based on Conducting Polypyrrole", The 7th International Conference on Micro Total Analysis Systems, Technical Digest, pp. 1195-1198, Squaw Valley, USA, October 5-9, 2003.
  46. K. S. Teh, Y. T. Cheng, and L. Lin, "Using Nickel Nanocomposite Films For the Fabrication of MEMS Microresonators", The 14th International Conference on Composite Materials, Technical Digest, ID1446, San Diego, USA, July 14-18, 2003.
  47. S. Ryder, K.B. Lee, X. Meng, and L. Lin, "Characterization of Out-of-Plane High Frequency Microresonators by AFM," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 424-427, Boston, June 2003.
  48. K.B. Lee and L. Lin, "Vertically Supported Microresonators," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 847-850, Boston, June 2003.
  49. J.B. Kim, H. Choo, L. Lin and R.S. Muller, "Microfabricated Torsional Actuator Using Self-Aligned Plastic Deformation," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 1015-1018, Boston, June 2003.
  50. J.B. Kim and L. Lin, "A Micro Pitch and Roll Motion Sensor," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 1387-1390, Boston, June 2003.
  51. K.S. Teh, Y.T. Cheng and L. Lin, "Nickel Nano-Composite Film For MEMS Applications," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 1534-1537, Boston, June 2003.
  52. Y.C. Su and L. Lin, "Geometry and Surface Assisted Flow Discretization," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 1812-1815, Boston, June 2003.
  53. M. Chiao and L. Lin, "Post-Packaging Tuning of Microresonators by Pulsed Laser Deposition," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 1820-1823, Boston, June 2003.
  54. O. Englander, D. Christensen, M. Chiao, J.B. Kim and L. Lin, "Localized Synthesis of Silicon Nanowires," 12th Int. Conference on Solid State Sensors and Actuators, Transducers'03, Technical Digest, pp. 186-189, Boston, June 2003.
  55. M. Chiao, K.B. Lam and Liwei Lin, "Micromachined Microbial Fuel Cells," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 383-386, Kyoto, Japan, Jan. 2003.
  56. K.B. Lee, F. Sammoura and Liwei Lin, "Water Activated Disposable and Long Shelf Life Microbatteries," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 387-390, Kyoto, Japan, Jan. 2003.
  57. K.B. Lam, M. Chiao, and Liwei Lin, "A Micro Photosynthetic Electrochemical Cell," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 391-394, Kyoto, Japan, Jan. 2003.
  58. K.B. Lee and Liwei Lin, "Surface Micromachined Glass and Polysilicon Microchannels Using MUMPs," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 578-581, Kyoto, Japan, Jan. 2003.
  59. S. Li, L.W. Pan and Liwei Lin, "Frozen Water for MEMS Fabrication and Packaging Applications," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 650-653, Kyoto, Japan, Jan. 2003.
  60. K.B. Lee, S. Ryder and Liwei Lin, "Design and Fabrication of an Annular High Frequency Resonator," 2002 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, New Orleans, Nov. 2002.
  61. D. Bystrom and Liwei Lin, "Residual Stress Analysis of Silicon-Aluminum-Glass Bonding Processes," 2002 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposium, CD ROM, Vol. 2, New Orleans, Nov. 2002.
  62. Mu Chiao, Kien B. Lam, Yu-Chuan Su and Liwei Lin, "A Miniaturized Microbial Fuel Cell," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 59-60, Hilton Head Island, June 2002.
  63. Mu Chiao and Liwei Lin, "A Wafer-Level Vacuum Packaging Process by RTP Aluminum-to-Nitride Bonding," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 81-85, Hilton Head Island, June 2002.
  64. Y.C. Su, Liwei Lin and A.P. Pisano, "A Water-Powered Micro Drug Delivery System," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 69-72, Hilton Head Island, June 2002.
  65. A. Cao, M. Chiao and Liwei Lin, "Selective and Localized Wafer Bonding Using Induction Heating," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 153-156, Hilton Head Island, June 2002.
  66. L.W. Pan, Y.C. Su, S. Li and Liwei Lin, "A Disposable Capillary Micropump Using Frozen Water as Sacrificial Layer," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 293-296, Hilton Head Island, June 2002.
  67. Mu Chiao and Liwei Lin, "Vacuum packaging of microresonators by rapid thermal processing," Proceedings of SPIE on Smart Electronics, MEMS, and Nanotechnology, Vol. 4700, No. 37, San Diego, March 17-21, 2002.
  68. K.B. Lee and Liwei Lin, "Electrolyte Based On-Demand and Disposable Microbattery," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 236-239, Las Vegas, Jan. 2002.
  69. D. Joachim and Liwei Lin, "Selective Polysilicon Deposition for Frequency Tuning of MEMS Resonators," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 727-730, Las Vegas, Jan. 2002.
  70. J.B. Kim, M. Chiao and Liwei Lin, "Ultrasonic Bonding of In/Au and Al/Al for Hermetic Sealing of MEMS Packaging," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 415-418, Las Vegas, Jan. 2002.
  71. (Invited Lecture)Liwei Lin, "Thermal Challenges in MEMS Applications: Phase Change Phenomena and Thermal Bonding Processes," Proceedings of the International Conference Thermes 2002, Thermal Challenges in Next Generation Electronic Systems, pp.35-44, Santa Fe, Jan. 2002.
  72. K.B. Lee and Liwei Lin, "Zinc Bonding for MEMS Packaging at the Wafer-Level," 2001 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposia, CD ROM, Vol. 2, New York, New York, Nov. 2001.
  73. A. Cao and Liwei Lin, "Selective Induction Heating for MEMS Packaging and Fabricatoin," 2001 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposia, CD ROM, Vol. 2, New York, New York, Nov. 2001.
  74. D. Joachim and Liwei Lin, "Design of MEMS Resonators for Tuning with Selective Polysilicon Deposition," 2001 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the MEMS Symposia, CD ROM, Vol. 2, New York, New York, Nov. 2001.
  75. M. Chiao and Liwei Lin, "Accelerated Hermeticity Testing of a Glass-Silicon Package Formed by RTP Aluminum-to-Silicon Nitride Bonding," 11th Int. Conference on Solid State Sensors and Actuators, Transducers'01 , Technical Digest, pp. 190-193, Munich, Germany, June 2001.
  76. J.-H. Tsai and Liwei Lin, "Thermal Bubble Powered Microfluidic Mixer with Gas Bubble Filter," 11th Int. Conference on Solid State Sensors and Actuators, Transducers'01 , Technical Digest, pp. 966-969, Munich, Germany, June 2001.
  77. C. Lu and Liwei Lin and M. Chiao, "Nanosecond-Pulsed Laser Bonding with a Built-in Mask for MEMS Packaging Applications," 11th Int. Conference on Solid State Sensors and Actuators, Transducers'01 , Technical Digest, pp. 214-217, Munich, Germany, June 2001.
  78. X. Shen and Liwei Lin, "Micro Plastic Hot Embossing Process: Experimental and Theoretical Characterizations," 11th Int. Conference on Solid State Sensors and Actuators, Transducers'01 , Technical Digest, pp.1640-1643, Munich, Germany, June 2001.
  79. Y.T. Cheng, W.T. Hsu, Liwei Lin, C.T. Nguyen and K. Najafi, "Vacuum Packaging Technology Using Localized Aluminum/Silicon-to Glass Bonding," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 18-21, Jan. 2001, Interlaken, Switzerland.
  80. Y.C. Su and Liwei Lin, "Localized Plastic Bonding for Micro Assembly, Packaging and Liquid Encapsulation," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 50-53, Jan. 2001, Interlaken, Switzerland.
  81. Jr-Hung Tsai and Liwei Lin, "A Thermal Bubble Actuated Micro Nozzle-Diffuser Pump," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 409-412, Jan. 2001, Interlaken, Switzerland.
  82. Y.C. Su, Liwei Lin and A.P. Pisano, "Water-Powered, Osmotic Microactuator," Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 393-396, Jan. 2001, Interlaken, Switzerland.
  83. Jr-Hung Tsai and Liwei Lin, "Transient Bubble Formation On A Polysilicon Micro Resister," 2000 ASME International Mechanical Engineering Congress and Exposition, Proceedings of the ASME Heat Transfer Division, Vol. 2, pp. 251-258, Orlando, Florida, 2000.
  84. Liwei Lin, "MEMS Post-Packaging by Localized Heating," 2000 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 2, pp. 629-635, Orlando, Florida, 2000.
  85. Jr-Hung Tsai and Liwei Lin, "Micro-to-Macro Fluidic Interconnectors with an Integrated Polymer Sealant," 2000 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 2, pp. 419-423, Orlando, Florida, 2000.
  86. Gary O'Brien, D. Monk and Liwei Lin, "MEMS Flip-Up Micro-Coil Inductor," 2000 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 2, pp. 349-353, Orlando, Florida, 2000.
  87. Gary O'Brien, D. Monk and Liwei Lin, "Electrostatic Latch and Release: A Theoretical and Emperical Study," 2000 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 2, pp. 19-26, Orlando, Florida, 2000.
  88. Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing," Proceedings of the 7th Mechatronics Forum International Conference, CD ROM, Atalanta, Georgia, 6-8 September, 2000.
  89. Jr-Hung Tsai and Liwei Lin, "Nozzle-Diffuser Based Micro Bubble Pump," Late News Poster Session Supplemental Digest of Solid-State Sensors and Actuators Workshop, pp. 13-14, Hilton Head Island, June 2000.
  90. Mu Chiao and Liwei Lin, "Hermetic Wafer Bonding Based on Rapid Thermal Processing," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 347-350, Hilton Head Island, June 2000.
  91. Todd Remtema and Liwei Lin, "Active Frequency Tuning for Microresonators by Localized Thermal Stressing Effects," Technical Digest of Solid-State Sensors and Actuators Workshop, pp. 363-366, Hilton Head Island, June 2000.
  92. Y.T. Cheng, Liwei Lin and K. Najafi, "Fabrication and Hermeticity Testing of a Glass-Silicon Package Formed Using Localized Aluminum/Silicon-to-Glass Bonding," Proceedings of IEEE Micro Electro Mechanical Systems Workshop, pp. 757-762, Jan. 2000, Miyazaki, Japan.
  93. Li-Wei Pan and Liwei Lin, "Batch Transfer of LIGA Microstructures by Selective Electroplating and Bonding," Proceedings of IEEE Micro Electro Mechanical Systems Workshop, pp. 259-264, Jan. 2000, Miyazaki, Japan.
  94. D. Joachim and Liwei Lin, "Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing," 1999 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 1, pp. 37-42, Nashville, Tennessee, 1999.
  95. G. O'Brien, Liwei Lin and D.J. Monk, "A Stiction Study Via C-V Plot Electrostatic Actuation/Latching," 1999 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 1, pp. 275-282, Nashville, Tennessee, 1999.
  96. J. Shah, Y.-C. Su and Liwei Lin, "Implementation and Analysis of Polymeric Replication by Micro-Injection Molding," 1999 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), MEMS-Vol. 1, pp. 295-302, Nashville, Tennessee, 1999.
  97. Liwei Lin, "MEMS Curriculum Development in Mechanical Engineering at the University of Michigan," 1999 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Mechanical Engineering Design Education: Issues and Case Studies , DE-Vol. 102, pp. 51-54, Nashville, Tennessee, 1999.
  98. G.H. He, Liwei Lin and Y.T. Cheng, "Localized CVD Bonding for MEMS Packaging," 10th Int. Conference on Solid State Sensors and Actuators, Transducers'99, Technical Digest, Sendai, Japan, June 1999, pp. 1312-1315.
  99. K.S. Teh, Liwei Lin and M. Chiao, "The Creep Behavior of Polysilicon Microstructure," 10th Int. Conference on Solid State Sensors and Actuators, Transducers'99 , Technical Digest, Sendai, Japan, June 1999, pp. 508-511.
  100. Li-Wei Pan, Liwei Lin and Jun Ni, "Cylindrical Plastic Lens Array Fabricated by a Micro Intrusion Process," Proceedings of IEEE Micro Electro Mechanical Systems Workshop, pp. 217-221, Jan. 1999, Orlando, Florida.
  101. Yu-Ting Cheng, Liwei Lin and Khalil Najafi, "Localized Bonding with PSG or Indium Solder as Intermediate Layer," Proceedings of IEEE Micro Electro Mechanical Systems Workshop, pp. 285-289, Jan. 1999, Orlando, Florida.
  102. Mong-Tung Lin, Wen-Jei Yang and Liwei Lin, "A Preliminary Study of Boiling on Micro Line Heaters," 11th International Symposium on Transport Phenomena, pp. 492-506, Nov. 29 - Dec. 3, 1998, Hsin-Chu, Taiwan.
  103. Liwei Lin (Invited Paper), "Micro-Mechanics in MEMS Development," 1998 International Conference on Mechatronic Technology, pp. 167-172, Nov. 30 - Dec. 2, 1998, Hsin-Chu, Taiwan.
  104. W.H. Lee and Liwei Lin, "Design, Fabrication and Characterization of Micro Fresnel Zone Plates," 1998 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), DSC-Vol. 66, pp. 505-512, Anaheim, California, 1998.
  105. W.T. ChangChien, Liwei Lin, Y.C. Lo and C.O. Chang, "Fabrication of 109.5 Degrees Micro V-Grooves Using a Two-Step Anisotropic Etching Technique," 1998 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), DSC-Vol. 66, pp. 361-364, Anaheim, California, 1998.
  106. K.S. Teh and Liwei Lin, "Time-dependent Buckling Phenomena of Polysilicon Micro Beams," Proceedings of the Forth International Workshop on Thermal Investigations of IC's and Microstructures, pp. 65-68, Cannes, France, Sep. 1998.
  107. Y.T. Cheng, Liwei Lin and Khalil Najafi, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging," Proceedings 1998 Solid-State Sensors and Actuators Workshop, pp. 233-236, Hilton Head, SC, June. 7-10, 1998.
  108. Liwei Lin (Invited Paper), "Engineering Mechanics Issues in MEMS," Proceedings of the ASCE 12th Engineering Mechanics Conference, pp. 44-47, La Jolla, CA, May, 17-20, 1998.
  109. Liwei Lin and Weijie Yun, "MEMS Pressure Sensors for Aerospace Applications," Proceedings of IEEE Aerospace Conference, CD ROM, MEMS workshop, paper No. 2, pp. 1-8, Aspen, Mar. 22-27, 1998.
  110. Liwei Lin, "Tribological Effects of Surface Roughness in MEMS Devices," Tribology Issues and Opportunities in MEMS, Edited by Bharat Bushan, Kluwer Academic Publishers, pp.455-462, 1998.
  111. Mu Chiao and Liwei Lin, "Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams," 1997 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS), Dallas, Texas, November, Vol. DSC-Vol. 62, 1997, pp. 75-80, Dallas, Texas.
  112. Liwei Lin, T.K. Shia and C.-J. Chiu, "Fabrication and Characterization of IC Processed Brightness Enhancement Films," 9th Int. Conference on Solid State Sensors and Actuators, Transducers'97, Technical Digest, Chicago, June 1997, pp. 1427-1430.
  113. Liwei Lin and Huey-Chi Chu, "Large Deflection Effects on Micro Diaphragms: A Theoretical and Experimental Study", 1996 ASME International Mechanical Engineering Congress and Exposition, Proceedings of Micro-Electro-Mechanical Systems(MEMS) , Atlanta, Georgia, November, Vol. DSC-Vol.59, 1996, pp. 447-452.
  114. Liwei Lin, C.-J. Chiu, W. Bacher and M. Heckele, "Microfabrication Using Silicon Mold Inserts and Hot Embossing", Proceedings of the Seventh International Symposium on Micro Machine and Human Science, Nagoya, Japan, October 1996, pp. 67-71.
  115. Liwei Lin, M. Chiao, J.-J. Luo and T.-P. Sun, "Electro, Thermal and Elastic Characterization of Suspended Micro Beams", Proceedings of the Second International Workshop on Thermal Investigations of IC's and Microstructures, Hungary, 1996, pp. 219-225.
  116. Liwei Lin, M. Chiao and H.-C. Chu, "Thermally Isolated Microstructures for Sensors and Actuators", Proceedings of the Sixth International Symposium on Micro Machine and Human Science, Nagoya, Japan, October 1995, pp. 89-96.
  117. Liwei Lin, W. Yun, H.-C. Chu and M. Chiao, "Surface Micromachined Diaphragm Pressure Sensors with Optimized Sensing Resistors", Proceedings of IEEE TENCON on Microelectronics and VLSI, Hong Kong, November 1995, pp. 24-27.
  118. Liwei Lin, A. P. Pisano and R. S. Muller, "IC-Processed Micro Needles", Int. Conference on Sensors and Actuators,.Transducers'93, Technical Digest, Yokohama, Japan, June 1993, pp. 237-240.
  119. Liwei Lin, K. McNair, R. T. Howe and A. P. Pisano, "Vacuum Encapsulated Lateral Microresonators", Int. Conference on Solid State Sensors and Actuators, Transducers'93, Technical Digest, Yokohama, Japan, June 1993, pp.270-273.
  120. Liwei Lin, K. S. Udell and A. P. Pisano, "Vapor Bubble Formation on a Micro Heater in Confined and Unconfined Micro Channels", 29th National Heat Transfer Conference, HTD-Vol. 253, Atlanta, U.S.A. August 1993, pp. 85-94.
  121. Liwei Lin, R. T. Howe and A. P. Pisano, "A Passive in situ Micro Strain Gauge", Proceedings of the 1993 IEEE Micro Electro Mechanical Systems, Ft. Lauderdale, Florida, U.S.A. February 1993, pp. 210-206.
  122. Liwei Lin, T. C. Nguyen, R. T. Howe and A. P. Pisano, "Micro Electromechanical Filters for Signal Processing", Proceedings of the 1992 IEEE Micro Electro Mechanical Systems, Travemunde, Germany, February 1992, pp. 226-231.
  123. Liwei Lin and A. P. Pisano, "Bubble Forming on a Micro Line Heater", ASME Winter Annual Meeting, DSC-Vol.32, Atlanta, U.S.A. December 1991, pp. 147-163.
  124. Liwei Lin, A. P. Pisano and A. P. Lee, "Microbubble Powered Actuator", Int. Conference on Sensors and Actuators, Transducers'91, Technical Digest, San Francisco, U.S.A. June 1991, pp. 1041-1044.
  125. D. Mirfendereski, Liwei Lin, A. D. Kiureghian and A. P. Pisano, "Probabilistic Response of Micro-Fabricated Polysilicon Beam Structures : Analysis and Experimental Verification", 1993 ASME Winter Annual Meeting, Symposium on Micro-Mechanical Systems, DSC-Vol.46, New Orleans, USA, November 1993, pp. 77-80.
  126. A. P. Lee, A. P. Pisano and Liwei Lin, "Normal and Tangential Impact in Micro Electromechanical Structures", Proceedings of the IEEE Micro Electro Mechanical Systems(MEMS'91) , Nara, Japan, February 1991, pp. 21-26.

Other Conference or Symposium Presentations

  1. Liwei Lin (Invited), "Bio Nano Fuel Cells," 2008 Emerging Information and Technology Conference (EITC), June 26-27, Tainan, Taiwan.
  2. Liwei Lin (Invited), "Integration of Nanostructures with Microsystems," ICMAT 2007, International Conference on Materials and Advanced Technologies, July 1-6, Singapore.
  3. Liwei Lin (Invited) "Bio Nano Fuel Cells," 4th USA-Korea Joint Symposium on MEMS and BioSystems Technology, Berkeley, November 2006.
  4. Liwei Lin (Invited), "Integration of Nanostructures with Microsystems," 2006 International Conference on Nanotechnology and advanced Materials," Hong Kong, Nov. 1-3, 2006.
  5. Liwei Lin (Invited), "Bioelectric PEM Fuel Cells," NSF Workshop: Emerging Opportunities of Nanoscience to Energy Conversion and Storage" Arlington, VI, November 2005.
  6. Liwei Lin (Invited), "Synthesis, Assembly and Integration of Nanowires/Nanotubes," 7th China Micro/Nano Systems Workshop, Dalian, China, August 13-17, 2005.
  7. Liwei Lin (Invited), "Bioelectric PEM Fuel Cells," 3rd Korea-USA Joint Symposium on MEMS and Biosystems Technology, pp. 105-117, KAIST, Daejeon, Korea, June 9-11, 2005.
  8. Liwei Lin, (Invited Keynote), "Synthesis, Assembly and Integration of Nanowires/Nanotubes," Proceedings of the Third Symposium on Intelligent Human Sensing, IHSS2005, pp. 1, March 3, 2005, Toyohashi, Japan.
  9. Liwei Lin and J.C. Chiao, "Integrated Manufacturing for Millimeterwave Sensing Systems," Proceedings of 2005 NSF Design & Manufacturing Research Conference, CD ROM, Scottsdale, Arizona, Jan. 3-6, 2005.
  10. Liwei Lin (Invited), "Bioelectric PEM Fuel Cells," International PEM Fuel Cell Conference, Hsin-Chu, Oct. 14-15, 2004.
  11. Liwei Lin (Invited), "Packaging Issues of MEMS Devices," Converging Technologies: MEMS and Wafer Level Packaging, MEPTEC Q2 Technical Symposium and Exhibits, Santa Clara, CA, May, 2004.
  12. Liwei Lin (Invited), "MEMS Baterries," Electric Power in Vivo Workshop and Symposium, USC, Los Angeles, February, 2004.
  13. Liwei Lin (Invited), "Nano/MEMS Technologies and Their Impacts on Aerospace Future Outlook," Aerospace Forum in Celebration of Human Centennial Power Flight, Tainan, Taiwan, December 22, 2003.
  14. Liwei Lin (Invited), "From MEMS to Nanotechnology," Chinese Institute of Engineers, Mechanics and Material Technology Group Dinner Seminar, Santa Clara, Nov. 7, 2003.
  15. Liwei Lin (Invited), "Thermal Bonding Processes for MEMS Packaging Applications," 2003 TMS Annual Meeting & Exhibition, San Diego, California, March 2-6, 2003.
  16. Liwei Lin (Invited), "Microscale Phase Change Devices," Proceedings of Colloquium on Micro/Nano Thermal Engineering, pp.299-319, Seoul, Korea, Feb. 2003.
  17. Liwei Lin (Invited), "MEMS Packaging by Selective Encapsulations," Thermo-Mechanical Issues in Packaging and Assembly of MEMS and MOEMS Conference, Brugges, Belgium, Nov. 2002.
  18. Liwei Lin (Invited), "Water-Powered Micro Drug Delivery System," 3rd Annual BioMEMS and Nanotech World 2002, Columbus, Ohio, September 6-8, 2002.
  19. Liwei Lin (Invited), "MEMS Research at UC-Berkeley," NATEA/NSC Joint Conference on MEMS and Network Security Santa Clara, September 7, 2002.
  20. Liwei Lin (Invited), "Packaging Issues of MEMS Devices," Pb-free Solder for Electronic, Optical, and MEMS Packaging Manufacturing," Los Angeles, CA, September 5-6, 2002.
  21. Liwei Lin (Invited), "Packaging, Power and Polymer MEMS," 2002 International Microsystem Technology Workshop, Hsin-Chu, Taiwan, July 25-26, 2002.
  22. Liwei Lin (Invited), "Water Powered Bioassay System," Pacific Rim Workshop on Transducers and Micro/Nano Technologies, Xiamen, China, July 22-24, 2002.
  23. Liwei Lin (Keynote), "Microscale Phase Change Devices," 2002 US-Japan Nanotherm Seminar, Nanoscale Thermal Science and Engineering, Berkeley, CA, June 24-26, 2002.
  24. Liwei Lin (Invited), "Plastic Microstructures for Optical and Drug-Delivery Applications," The Golden Gate Polymer Forum, San Jose, May 30, 2002.
  25. Liwei Lin, "MEMS Packaging and Reliability," 2001 ASME International Mechanical Engineering Congress and Exposition, New York, New York, Nov. 2001.
  26. Liwei Lin (Invited), "Vacuum Encapsulation Processes for MEMS Resonators," IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, Scotts Valley, CA, Nov. 8-10, 2001.
  27. Liwei Lin (Invited), "MEMs Post-Packaging at the Wafer-Level," The PACIFIC RIM/International Intersociety, Electronic Packaging Technical/Business Conference & Exhibition (InterPACK 2001) Kauai, Hawaii, July 8-13, 2001.
  28. L.W. Pan and Liwei Lin, "Flip-Chip Electrical Interconnection by Selective Electroplating and Bonding," Book of Abstracts of Forth International Workshop on High-Aspect-Ratio Microstructure Technology (HARMST'01), pp. 209-210, Baden-Baden, Germany, June 17-19, 2001.
  29. L.W. Pan and Liwei Lin, "Electroplated 3D Microstructure Fabricated by a Step-Height Control Method," Book of Abstracts of Forth International Workshop on High-Aspect-Ratio Mic rostructure Technology (HARMST'01), pp.197-198, Baden-Baden, Germany, June 17-19, 2001.
  30. Li-Wei Pan and Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturin g via Selective Electroplating and Bonding," Proceedings of 2001 NSF Design & Manufacturing Research Conference, CD ROM, Tampa, Florida, Jan. 7-10, 2001.
  31. Liwei Lin (Invited), "MEMS Packaging at the Wafer-Level," 2000 IMAPS Advanced Technology Workshop on Packaging and Integration of MEMS & Related Microsystems, Orlando, Florida, November 10-12, 2000.
  32. Li-Wei Pan and Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing via Electroplating," Proceedings of 2000 NSF Design & Manufacturing Research Conference, CD ROM, paper no. MME-230, Vancouver, Canada, Jan. 3-6, 2000.
  33. Liwei Lin (Invited), "Micro-Science and Tribology," Abstract Book of 46th International Symposium of American Vacuum Society, Oct. 25-29, Seattle, Washington, pp. 141, 1999.
  34. Liwei Lin, "Microencapsulation Shells for MEMS Packaging," Abstract Book of IMAPS Advanced Technology Workshop on Packaging of MEMS Microsystems, Oct. 23-24, Chicago, 1999.
  35. L.W. Pan, Liwei Lin and Jun Ni, "A Flip-Chip LIGA Assembly Technique via Electroplating," Abstract book of HARMST'99, Tokyo, Japan, June 1999.
  36. Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing," NIST-NSF Workshop on Manufacturing of Three-Dimensional Structures and Devices at the Meso and Micro Scales, Gaithersburg, Maryland, May 18-19, 1999.
  37. Liwei Lin (Invited), "MEMS Research at MEAM - the University of Michigan," Proceedings of National Important Projects-MOEMS Workshop, Shanghai, China, March 5-7, 1999.
  38. Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing," Proceedings of 1999 NSF Design & Manufacturing Grantees Conference, CD ROM, paper no. MME-27, Long Beach, CA, Jan. 5-8, 1999.
  39. Liwei Lin and Yen-Wen Lu, "Structural Analysis of MEMS Pressure Sensors for Disk/Head Interfacial Contact application," Abstract Book of 1998 AFOSR/ONR/NSF Tribology Program Review, June 22-25, Annapolis, MD, 1998.
  40. Liwei Lin, "Tribology Issues in MEMS for Automotive Applications," 1998 SAE International Congress & Exposition, Feb. 22-27, Detroit, 1998.
  41. Liwei Lin, "MEMS Post-Packaging by Localized Heating," Abstract book of IMAPS Advanced Technology Workshop on Sensor Packaging, Ojai, Jan. 1998.
  42. Liwei Lin, "Tribological Effects of Surface Roughness in MEMS Devices," Abstract book of NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS, Columbus, Ohio, Nov. 9-11, 1997.
  43. Liwei Lin, Y.T. Cheng and C.-J. Chiu, "Comparative Study of Hot Embossed Microstructures Fabricated by Laboratory and Commercial Environments," Abstract book of HARMST'97, Madison, June 1997.
  44. Liwei Lin, "Microscale Thermal Bubble Formation: Thermophysical Phenomena and Applications," Workshop on Thermophysical Phenomena in Microscale Sensors, Devices, and Structures, Baltimore, August 1997.
  45. W.H. Lee, Liwei Lin, Y. Cheng and S. Su, "Process Optimization and Characterization for Micro Fresnel Zone Plates", Proceedings of the Photonics/Taiwan '96, Vol. 2, pp. 318-321, Hsin-Chu, Taiwan, 1996.
  46. W.T. Changchien, Liwei Lin, Y.C. Lo and G.O. Chang, "Fabrication of 70.5 and 109.5 Degrees V-Grooves by Anisotropic Etching of Silicon," 1997 Annual Conference of the Chinese Society for Material Science, (in Chinese) pp. F5-9, Tainan, Taiwan, 1997.
  47. C.H. Lin, Liwei Lin, Y.F. Chou and Y.C. Lo, "Fabrication of Hemispherical Shapes by Isotropic Etching of Silicon," 1997 Annual Conference of the Chinese Society for Material Science, (in Chinese) pp. F10-13, Tainan, Taiwan, 1997.

Book & Book Chapters

  1. JongBaeg Kim, Yu-Ting Cheng, Mu Chiao and Liwei Lin, "Packaging and Reliability Issues in Micro/Nano Systems," Handbook or Nanotechnology, 2nd edition Springer-Verlag Berlin Heidelberg, ISBN-10:3-540-29855-X, pp. 1777-1803, 2007.
  2. Y.T. Cheng and Liwei Lin, "MEMS Packaging and Thermal Issues in Reliability," Handbook or Nanotechnology, Springer-Verlag Berlin Heidelberg, ISBN 3-540-01218-4, pp. 1111-1132, Jan. 2004.
  3. M. Chiao and Liwei Lin, "Sealing Technologies," MEMS Packaging, The Institution of Electrical Engineers, London, United Kingdom, ISBN 0-86341-335-8, pp. 61-83, Jan. 2004.
  4. Abe Lee, Liwei Lin, et al. Editors, "Proceedings of Micro-Electro-Mechanical Systems(MEMS)," 1999 ASME International Mechanical Engineering Congress and Exposition , ASME MEMS Vol. 1, ISBN No. 0-7918-1638-9, 1999.
  5. Liwei Lin, et al. Editors, "Proceedings of Micro-Electro-Mechanical Systems(MEMS)," 1998 ASME International Mechanical Engineering Congress and Exposition , ASME DSC-Vol. 66, ISBN No. 0-7918-1596-X, 1998.
  6. Liwei Lin, et al. Editors, "Proceedings of Micro-Electro-Mechanical Systems(MEMS)," 1997 ASME International Mechanical Engineering Congress and Exposition, ASME DSC-Vol. 62, HTD-Vol. 354, ISBN No. 0-7918-1843-8, 1997.

Patents

  1. Liwei Lin, T. C. Nguyen, R. T. Howe and A. P. Pisano, "Micro Electromechanical Signal Processor", US patent, No. 5,455,547, Oct. 3, 1995.
  2. Liwei Lin, T. C. Nguyen, R. T. Howe and A. P. Pisano, "Micro Electromechanical Signal Processor", US patent, No. 5,537,083, July 16, 1996.
  3. Liwei Lin, T. C. Nguyen, R. T. Howe and A. P. Pisano, "Micro Electromechanical Signal Processor Fabrication", US patent, No. 5,589,082, Dec. 31, 1996.
  4. Liwei Lin and A. P. Pisano, "IC-Processed Microneedles", US patent, No. 5,591,139, Jan. 9, 1997.
  5. Weijie Yun, Liwei Lin and Tariq Haniff, "Method of Making a Surface Micro-machined Silicon Pressure Sensors", US patent, No. 5,759,870, June 2, 1998.
  6. Liwei Lin and A. P. Pisano, "IC-Processed Microneedles", US patent, No. 5,855,801, Jan. 5, 1999.
  7. Liwei Lin, Yu-Ting Cheng, Khalil Najafi and Kensall Wise, "Process for Making Microstructures and Microstructures Made Thereby," US patent, No. 6,232,150, May 15, 2001.
  8. Liwei Lin, Yu-Ting Cheng, Khalil Najafi and Kensall Wise, "Microstructures," US patent, No. 6,436,853 August 20, 2002. pdf
  9. JongBaeg Kim and Liwei Lin, "Microfabricated Vertical Comb Actuator Using Plastic Deformation," US patent, No. 7,089,666, August 15, 2006.
  10. Mu Chiao, Liwei Lin and Kien Lam, "Implantable, Miniaturized Microbial Fuel Cell," US Patent No. 7,160,637, January 9, 2007.
  11. Jeong Jin Kang, Young Moo Heo, Liwei Lin and Firas Sammoura, "Micro-Needle Which Has Proper Shape for Injection Mold and So Mass-Produced by Means of Injection Mold," Korea Patent No. 10-0784848, December 05, 2007. pdf
  12. Liwei Lin, Ongi Englander, Dane Christensen, "Localized Synthesis and Self-assembly of Nanostructures," US Patent No. 7,311,776, December 25, 2007.
  13. JongBaeg Kim and Liwei Lin, "Microfabricated Vertical Comb Actuator Using Plastic Deformation," US patent, No. 7,342,346, March 11, 2008.